KGD-128Mbx32-LPDDR3-SDRAM-1.2V

LPDDR3 SDRAM KGD
Part Description

LPDDR3 SDRAM 1.2V

Quantity 1,591 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPDDR3 SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization128M x 32
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.36

Overview of KGD-128Mbx32-LPDDR3-SDRAM-1.2V – LPDDR3 SDRAM 1.2V

The KGD-128Mbx32-LPDDR3-SDRAM-1.2V from ESMT is a volatile DRAM device implemented in LPDDR3 SDRAM technology with a memory organization of 128M × 32. Packaged and delivered as Known Good Die (KGD), this part provides a discrete LPDDR3 memory element with a parallel memory interface.

Key device identifiers include its LPDDR3 SDRAM technology, parallel interface, and specified supply voltage listed in the product data. The part is RoHS compliant and supplied by ESMT as part of their LPDDR3 SDRAM series.

Key Features

  • Memory Type & Format  Volatile DRAM implemented using LPDDR3 SDRAM technology for common DRAM use cases.
  • Memory Organization  128M × 32 organization, providing the specified memory capacity and data width as listed in the product data.
  • Interface  Parallel memory interface as specified in the product information.
  • Voltage Supply  Specified supply voltage: 2.5V (as provided in the product data).
  • Grade  Known Good Die (KGD) grade for die-level supply and assembly integration workflows.
  • Manufacturer & Series  Produced by ESMT and listed under the ESMT LPDDR3 SDRAM series.
  • Environmental Compliance  RoHS compliant as indicated in the product data.

Typical Applications

  • Memory Module Assembly  Used as a Known Good Die component in memory module or package assembly processes where die-level LPDDR3 is required.
  • Embedded Memory Subsystems  Can be integrated into embedded designs that require volatile DRAM with a parallel interface and the specified organization.
  • Production and Test  Suitable for manufacturing workflows that use KGD parts for downstream assembly and validation.

Unique Advantages

  • Die-Level Supply (Known Good Die):  Delivered as KGD to support die-level assembly and reduce uncertainty during module production.
  • LPDDR3 Technology:  Identified LPDDR3 SDRAM implementation as the device technology per product data.
  • Defined Memory Organization:  128M × 32 organization gives a clear capacity and data-width specification for system planning.
  • Parallel Interface:  Parallel memory interface simplifies integration where a parallel DRAM interface is required.
  • RoHS Compliance:  Environmentally compliant per the product data, supporting regulatory requirements for lead-free assembly.

Why Choose KGD-128Mbx32-LPDDR3-SDRAM-1.2V?

KGD-128Mbx32-LPDDR3-SDRAM-1.2V is positioned as a manufacturer-specified LPDDR3 SDRAM die for designs and assemblies that require a defined 128M × 32 volatile DRAM element with a parallel interface and KGD quality. Its ESMT provenance and RoHS compliance are documented in the product data.

This part is suitable for design and manufacturing teams that require die-level LPDDR3 memory elements for integration into modules or embedded subsystems, providing a clear specification set for memory organization, interface, and supply voltage as listed in the product information.

Request a quote or submit an inquiry to purchase KGD-128Mbx32-LPDDR3-SDRAM-1.2V and include your required quantities and delivery preferences for a prompt response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1998


    Headquarters: Hsinchu Science Park, Hsinchu, Taiwan


    Employees: 400+


    Revenue: $377.8 Million


    Certifications and Memberships: N/A


    Featured Products
    Latest News
    keyboard_arrow_up