KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V

NAND Flash KGD
Part Description

SLC NAND Flash, x8, 1.8V/3V

Quantity 1,667 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatNAND FlashTechnologySLC NAND Flash
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization128M x 8
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V – SLC NAND Flash, x8, 1.8V/3V

The KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V is a non-volatile SLC NAND Flash memory device offered as a Known Good Die (KGD). It provides a 128M × 8 memory organization on a parallel NAND interface for integration into memory assemblies and module builds.

This device is positioned for use where single-level-cell NAND storage is required and where component-grade die is needed for advanced packaging and assembly workflows.

Key Features

  • Memory Type – Non-Volatile: Implements non-volatile storage using SLC NAND Flash technology to retain data without power.
  • Technology – SLC NAND Flash: Single-level cell NAND Flash architecture provided as the device technology.
  • Memory Organization – 128M × 8: Organized as 128M by 8 bits to support byte-wide parallel access patterns.
  • Interface – Parallel: Parallel memory interface for direct integration with parallel NAND controllers and assembly processes.
  • Power – 2.5V Supply: Device voltage supply specified at 2.5V.
  • Grade – Known Good Die (KGD): Supplied as Known Good Die grade, suitable for module-level packaging and advanced assembly flows.
  • Compliance – RoHS: RoHS compliant as provided in the product environmental specification.

Typical Applications

  • Memory assembly and module production: For use by manufacturers integrating NAND die into packaged memory modules or multi-die assemblies using KGD parts.
  • Parallel NAND system designs: For systems that require a parallel x8 NAND Flash device with a 128M × 8 organization.
  • Embedded non-volatile storage: For embedded designs that specify SLC NAND Flash die for storage or firmware retention.

Unique Advantages

  • Known Good Die availability: Supplied as KGD grade to support downstream packaging and integration workflows with pre-qualified die.
  • Clear memory organization: 128M × 8 arrangement simplifies sizing and integration for designs targeting that capacity and data width.
  • Parallel interface compatibility: Parallel x8 interface aligns with conventional NAND controller integration approaches and assembly processes.
  • Explicit power specification: 2.5V supply defined in product specifications to support power budgeting and system design.
  • RoHS compliant: Environmental compliance is specified, supporting regulatory and manufacturing requirements.

Why Choose KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V?

The KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V delivers SLC NAND Flash memory in a 128M × 8 organization with a parallel interface and Known Good Die grade, making it suitable for designs and manufacturing flows that require die-level NAND for packaging and module assembly. Its documented 2.5V supply and RoHS compliance provide clear electrical and environmental parameters for system integration.

This part is appropriate for engineers and manufacturers specifying die-level SLC NAND for embedded storage, module production, or parallel NAND system designs where component-level qualification and assembly readiness are important.

Request a quote or submit an inquiry to receive pricing and availability for KGD-128Mbx8-SLC-NAND-Flash,-x8,-1.8V/3V and to discuss how this Known Good Die can fit into your assembly or system design workflow.

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