KGD-16Mbx16-LPSDR-SDRAM-1.8V
| Part Description |
LPSDR SDRAM 1.8V |
|---|---|
| Quantity | 1,777 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | LPSDR SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.24 |
Overview of KGD-16Mbx16-LPSDR-SDRAM-1.8V – LPSDR SDRAM 1.8V
The KGD-16Mbx16-LPSDR-SDRAM-1.8V from ESMT is a volatile memory device in Known Good Die (KGD) form, implemented using LPSDR SDRAM technology. It is organized as 16M × 16 with a parallel memory interface and is supplied at 2.5V.
This offering is intended for designs that require a die-level LPSDR SDRAM component with clear organization and interface characteristics for integration into memory subsystems or module assemblies.
Key Features
- Memory Type & Format Volatile DRAM implemented using LPSDR SDRAM technology.
- Memory Organization 16M × 16 organization provides a defined data width and address capacity for system designers.
- Memory Interface Parallel memory interface for direct integration into parallel DRAM controllers and subsystems.
- Voltage Supply Specified supply voltage: 2.5V as documented for this part.
- Grade Known Good Die (KGD) grade, supplied as die for die-level assembly and integration workflows.
- Compliance RoHS compliant material status for environmental and regulatory conformity.
- Manufacturer & Series Manufactured by ESMT as part of the ESMT LPSDR SDRAM KGD-16Mbx16-LPSDR-SDRAM-1.8V series.
Typical Applications
- Memory subsystem integration Die-level LPSDR SDRAM for incorporation into custom memory modules and subsystem designs.
- Module and board assembly Intended for assembly processes that require Known Good Die components for upstream testing and integration.
- Embedded memory solutions Use where a defined 16M × 16 DRAM organization and parallel interface meet system memory requirements.
Unique Advantages
- Die-level delivery (KGD): Provides Known Good Die status for customers who require die for direct assembly or advanced packaging.
- Clear memory organization: 16M × 16 configuration simplifies capacity planning and bus-width design decisions.
- Parallel interface: Straightforward integration with parallel DRAM controllers and legacy memory architectures.
- Defined supply specification: Documented 2.5V supply requirement for accurate power budgeting.
- Regulatory compliance: RoHS-compliant construction supports environmental compliance in production.
Why Choose KGD-16Mbx16-LPSDR-SDRAM-1.8V?
KGD-16Mbx16-LPSDR-SDRAM-1.8V positions itself as a die-level LPSDR SDRAM option with a clear 16M × 16 organization, parallel interface, and Known Good Die grading from ESMT. It is suited for engineers and manufacturers who need a defined DRAM die for module assembly, subsystem integration, or embedded memory implementations.
With RoHS compliance and a specified 2.5V supply requirement, this part supports consistent integration and regulatory considerations in production environments where die-level memory components are required.
Request a quote or submit an inquiry for pricing and availability to evaluate KGD-16Mbx16-LPSDR-SDRAM-1.8V for your designs.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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Revenue: $377.8 Million
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