KGD-16Mbx16-LPSDR-SDRAM-1.8V

SDRAM KGD
Part Description

LPSDR SDRAM 1.8V

Quantity 1,777 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPSDR SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.24

Overview of KGD-16Mbx16-LPSDR-SDRAM-1.8V – LPSDR SDRAM 1.8V

The KGD-16Mbx16-LPSDR-SDRAM-1.8V from ESMT is a volatile memory device in Known Good Die (KGD) form, implemented using LPSDR SDRAM technology. It is organized as 16M × 16 with a parallel memory interface and is supplied at 2.5V.

This offering is intended for designs that require a die-level LPSDR SDRAM component with clear organization and interface characteristics for integration into memory subsystems or module assemblies.

Key Features

  • Memory Type & Format  Volatile DRAM implemented using LPSDR SDRAM technology.
  • Memory Organization  16M × 16 organization provides a defined data width and address capacity for system designers.
  • Memory Interface  Parallel memory interface for direct integration into parallel DRAM controllers and subsystems.
  • Voltage Supply  Specified supply voltage: 2.5V as documented for this part.
  • Grade  Known Good Die (KGD) grade, supplied as die for die-level assembly and integration workflows.
  • Compliance  RoHS compliant material status for environmental and regulatory conformity.
  • Manufacturer & Series  Manufactured by ESMT as part of the ESMT LPSDR SDRAM KGD-16Mbx16-LPSDR-SDRAM-1.8V series.

Typical Applications

  • Memory subsystem integration  Die-level LPSDR SDRAM for incorporation into custom memory modules and subsystem designs.
  • Module and board assembly  Intended for assembly processes that require Known Good Die components for upstream testing and integration.
  • Embedded memory solutions  Use where a defined 16M × 16 DRAM organization and parallel interface meet system memory requirements.

Unique Advantages

  • Die-level delivery (KGD): Provides Known Good Die status for customers who require die for direct assembly or advanced packaging.
  • Clear memory organization: 16M × 16 configuration simplifies capacity planning and bus-width design decisions.
  • Parallel interface: Straightforward integration with parallel DRAM controllers and legacy memory architectures.
  • Defined supply specification: Documented 2.5V supply requirement for accurate power budgeting.
  • Regulatory compliance: RoHS-compliant construction supports environmental compliance in production.

Why Choose KGD-16Mbx16-LPSDR-SDRAM-1.8V?

KGD-16Mbx16-LPSDR-SDRAM-1.8V positions itself as a die-level LPSDR SDRAM option with a clear 16M × 16 organization, parallel interface, and Known Good Die grading from ESMT. It is suited for engineers and manufacturers who need a defined DRAM die for module assembly, subsystem integration, or embedded memory implementations.

With RoHS compliance and a specified 2.5V supply requirement, this part supports consistent integration and regulatory considerations in production environments where die-level memory components are required.

Request a quote or submit an inquiry for pricing and availability to evaluate KGD-16Mbx16-LPSDR-SDRAM-1.8V for your designs.

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