KGD-16Mbx32-LPSDR-SDRAM-1.8V

SDRAM KGD
Part Description

LPSDR SDRAM 1.8V

Quantity 1,262 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPSDR SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization16M x 32
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.28

Overview of KGD-16Mbx32-LPSDR-SDRAM-1.8V – LPSDR SDRAM 1.8V

KGD-16Mbx32-LPSDR-SDRAM-1.8V is a volatile DRAM device from ESMT's LPSDR SDRAM series, provided in Known Good Die (KGD) grade. The part is organized as 16M × 32 and uses LPSDR SDRAM technology with a parallel memory interface.

The product name includes "1.8V" while the specified supply voltage in the product data is 2.5V. This part is RoHS compliant and is offered as a die for integration into memory assemblies and subsystem designs.

Key Features

  • Memory Type & Format  Volatile memory in DRAM format using LPSDR SDRAM technology.
  • Memory Organization  16M × 32 organization provides a defined capacity and 32-bit data width.
  • Interface  Parallel memory interface for parallel access architectures.
  • Voltage Supply  Specified supply voltage: 2.5V; product name includes 1.8V.
  • Grade  Known Good Die (KGD) grade intended for die-level assembly and integration.
  • Environmental Compliance  RoHS compliant for use in RoHS-directed assemblies.
  • Manufacturer & Series  Manufactured by ESMT as part of the ESMT LPSDR SDRAM series.

Typical Applications

  • Die-level memory integration  KGD grade enables integration into multi-die packages and direct die attachment workflows where a 16M × 32 LPSDR SDRAM is required.
  • Board-level parallel memory  Designed for systems that incorporate parallel DRAM interfaces and require a defined 32-bit data width.
  • OEM memory subsystems  Suitable for OEMs assembling memory modules or subsystems that specify LPSDR SDRAM technology and KGD die delivery.

Unique Advantages

  • Known Good Die for assembly  Delivered as KGD to support die-level assembly and reduce the need for additional wafer-level testing by integrators.
  • Defined memory organization  16M × 32 layout simplifies capacity planning and address mapping in system design.
  • Parallel interface  Supports parallel memory access schemes for designs that require parallel DRAM connectivity.
  • RoHS compliant  Meets RoHS requirements for integration into compliant products and supply chains.
  • ESMT series consistency  Part of the ESMT LPSDR SDRAM series for consistent technology and manufacturing provenance.

Why Choose KGD-16Mbx32-LPSDR-SDRAM-1.8V?

KGD-16Mbx32-LPSDR-SDRAM-1.8V provides a clear specification set for designers needing a 16M × 32 LPSDR SDRAM delivered as Known Good Die. Its parallel interface and KGD delivery make it suitable for die-level integration and memory subsystem assembly where RoHS compliance and defined memory organization are required.

Manufactured by ESMT as part of the LPSDR SDRAM series, this part is appropriate for teams and OEMs that require die-format DRAM with explicit organization and environmental compliance. The provided supply voltage specification and KGD grade support predictable integration into controlled assembly flows.

Request a quote or submit an inquiry to obtain pricing and availability for KGD-16Mbx32-LPSDR-SDRAM-1.8V. Our team can provide ordering details and support for die-level integration requirements.

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