KGD-16Mbx16-SDRAM-2.5V/3.3V
| Part Description |
SDRAM 2.5V/3.3V |
|---|---|
| Quantity | 1,103 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.24 |
Overview of KGD-16Mbx16-SDRAM-2.5V/3.3V – SDRAM 2.5V/3.3V
The KGD-16Mbx16-SDRAM-2.5V/3.3V from ESMT is a volatile DRAM device implemented as SDRAM with a memory organization of 16M × 16. It provides a parallel memory interface and is supplied at 2.5V per the product specifications.
Offered in Known Good Die grade and RoHS compliant, this SDRAM is intended for designs that require straightforward parallel DRAM integration and a defined 16M × 16 memory footprint.
Key Features
- Memory Type — Volatile DRAM: Implemented as SDRAM, providing conventional dynamic random-access memory behavior suitable for temporary data storage.
- Memory Organization — 16M × 16: Fixed 16M by 16-bit organization for predictable capacity and data-width planning in system designs.
- Interface — Parallel: Parallel memory interface for integration with parallel memory controllers and board-level memory architectures.
- Voltage Supply — 2.5V: Specified supply voltage of 2.5V as listed in the product specifications.
- Grade — Known Good Die (KGD): Supplied as Known Good Die to support die-level assembly and downstream testing requirements.
- Environmental Compliance — RoHS: RoHS compliant to meet regulatory requirements for lead-free assemblies.
Typical Applications
- System memory for embedded designs: Serves as SDRAM for systems that require a defined 16M × 16 volatile memory block with a parallel interface.
- Board-level memory integration: Used where a parallel SDRAM die is required for solder-down or die-attach assembly in custom modules.
- Die-level assembly and test workflows: Known Good Die grade supports assembly flows that require pre-validated die for downstream packaging and testing.
Unique Advantages
- Clear memory footprint: 16M × 16 organization simplifies capacity planning and controller mapping.
- Parallel interface compatibility: Enables integration with designs expecting standard parallel SDRAM signaling.
- Known Good Die grading: Reduces risk in die-level assembly by delivering pre-tested, validated die.
- Specified 2.5V supply: Explicit voltage specification supports designs targeting a 2.5V power domain.
- RoHS compliant: Meets environmental compliance needs for lead-free manufacturing.
- Manufacturer identification: Supplied by ESMT, providing traceability to the original component source.
Why Choose KGD-16Mbx16-SDRAM-2.5V/3.3V?
KGD-16Mbx16-SDRAM-2.5V/3.3V positions itself as a straightforward SDRAM die option for designs that require a 16M × 16 volatile memory block with a parallel interface and a specified 2.5V supply. Its Known Good Die grade and RoHS compliance make it suitable for die-level assembly flows and environmentally regulated production.
This product is appropriate for engineers and procurement teams seeking a clearly specified SDRAM die from a recognized manufacturer for integration into board-level memory subsystems or custom module assemblies.
Request a quote or submit a purchase inquiry to learn about availability, pricing, and delivery for KGD-16Mbx16-SDRAM-2.5V/3.3V.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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