KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V

DDR3 SDRAM KGD
Part Description

DDR3 1.35V/ 1.5V

Quantity 1,554 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyDDR3 SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization32M x 16 / 64M x 8
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.28

Overview of KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V – DDR3 1.35V/ 1.5V

The KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V from ESMT is a DDR3 SDRAM offering provided in Known Good Die (KGD) format. It is a volatile DRAM device organized as 32M × 16 or 64M × 8 with a parallel memory interface and is supplied under the ESMT DDR3 SDRAM KGD series.

This product targets memory product integration and manufacturing workflows that require DDR3 SDRAM in KGD form, offering explicit organization options and compliance with RoHS environmental requirements.

Key Features

  • Memory Type and Technology  DDR3 SDRAM volatile memory in DRAM format, suitable for designs that require DDR3 architecture.
  • Memory Organization  Offered in 32M × 16 and 64M × 8 organizations to support different bus widths and capacity layouts.
  • Interface  Parallel memory interface compatible with parallel DDR3 implementations.
  • Voltage Specification  Product name denotes 1.35V / 1.5V DDR3 variants; the listed voltage supply in specifications is 2.5V.
  • Grade  Known Good Die (KGD) grade—provided as validated die intended for die-level assembly and integration.
  • Environmental Compliance  RoHS compliant to meet environmental substance regulations.
  • Manufacturer and Series  Part of the ESMT DDR3 SDRAM KGD series, manufactured by ESMT.

Typical Applications

  • Memory product manufacturing  KGD format suited for wafer- or die-level assembly in memory product manufacturing and packaging flows.
  • Parallel memory interface designs  Use in systems and subsystems that integrate DDR3 devices with parallel memory interfaces.
  • OEM memory integration  Provision for original equipment manufacturers requiring DDR3 die in board- or module-level designs.

Unique Advantages

  • Known Good Die availability  Supplied in KGD grade to support die-level assembly and reduce uncertainty during integration.
  • Multiple organization options  32M × 16 and 64M × 8 organizations provide flexibility for varying bus-width and capacity requirements.
  • Explicit DDR3 technology  DDR3 SDRAM designation clarifies the memory technology for system selection and inventory management.
  • RoHS compliance  Meets RoHS requirements for environmentally restricted substance control.
  • ESMT series consistency  Part of the ESMT DDR3 SDRAM KGD series, providing alignment with ESMT's memory product lineup.

Why Choose KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V?

The KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V is positioned for designs and manufacturing processes that require DDR3 SDRAM in Known Good Die form, with clear organization choices and a parallel interface. Its RoHS compliance and inclusion in the ESMT DDR3 SDRAM KGD series make it suitable for procurement and integration where die-level memory components are specified.

This part is appropriate for engineers and procurement teams looking for verified DDR3 die options from ESMT, supporting scalable assembly and memory product workflows where KGD format and explicit memory organization are required.

Request a quote or submit an inquiry to purchase KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V and discuss availability and volume options with our sales support team.

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