KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V
| Part Description |
DDR3 1.35V/ 1.5V |
|---|---|
| Quantity | 1,554 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | DDR3 SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 32M x 16 / 64M x 8 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.28 |
Overview of KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V – DDR3 1.35V/ 1.5V
The KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V from ESMT is a DDR3 SDRAM offering provided in Known Good Die (KGD) format. It is a volatile DRAM device organized as 32M × 16 or 64M × 8 with a parallel memory interface and is supplied under the ESMT DDR3 SDRAM KGD series.
This product targets memory product integration and manufacturing workflows that require DDR3 SDRAM in KGD form, offering explicit organization options and compliance with RoHS environmental requirements.
Key Features
- Memory Type and Technology DDR3 SDRAM volatile memory in DRAM format, suitable for designs that require DDR3 architecture.
- Memory Organization Offered in 32M × 16 and 64M × 8 organizations to support different bus widths and capacity layouts.
- Interface Parallel memory interface compatible with parallel DDR3 implementations.
- Voltage Specification Product name denotes 1.35V / 1.5V DDR3 variants; the listed voltage supply in specifications is 2.5V.
- Grade Known Good Die (KGD) grade—provided as validated die intended for die-level assembly and integration.
- Environmental Compliance RoHS compliant to meet environmental substance regulations.
- Manufacturer and Series Part of the ESMT DDR3 SDRAM KGD series, manufactured by ESMT.
Typical Applications
- Memory product manufacturing KGD format suited for wafer- or die-level assembly in memory product manufacturing and packaging flows.
- Parallel memory interface designs Use in systems and subsystems that integrate DDR3 devices with parallel memory interfaces.
- OEM memory integration Provision for original equipment manufacturers requiring DDR3 die in board- or module-level designs.
Unique Advantages
- Known Good Die availability Supplied in KGD grade to support die-level assembly and reduce uncertainty during integration.
- Multiple organization options 32M × 16 and 64M × 8 organizations provide flexibility for varying bus-width and capacity requirements.
- Explicit DDR3 technology DDR3 SDRAM designation clarifies the memory technology for system selection and inventory management.
- RoHS compliance Meets RoHS requirements for environmentally restricted substance control.
- ESMT series consistency Part of the ESMT DDR3 SDRAM KGD series, providing alignment with ESMT's memory product lineup.
Why Choose KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V?
The KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V is positioned for designs and manufacturing processes that require DDR3 SDRAM in Known Good Die form, with clear organization choices and a parallel interface. Its RoHS compliance and inclusion in the ESMT DDR3 SDRAM KGD series make it suitable for procurement and integration where die-level memory components are specified.
This part is appropriate for engineers and procurement teams looking for verified DDR3 die options from ESMT, supporting scalable assembly and memory product workflows where KGD format and explicit memory organization are required.
Request a quote or submit an inquiry to purchase KGD-32Mbx16/-64Mb-x8-DDR3-1.35V/-1.5V and discuss availability and volume options with our sales support team.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A