KGD-4Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V

The KGD-4Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V is a memory component from ESMT offered in the ESMT SPI NAND KGD-4Gb-SLC series. Product data lists it as a non-volatile memory element with a 4G × 8 organization and a parallel memory interface, provided as a Known Good Die (KGD).

Key technical identifiers for the part include a DRAM memory format and DDR SDRAM technology entries in the specifications, a listed nominal voltage supply of 2.5V, and RoHS compliance. The part name also indicates internal ECC and voltage markers "1.8V/3V" as part of the series designation.

Key Features

• Manufacturer & Series Supplied by ESMT as part of the ESMT SPI NAND KGD-4Gb-SLC series, providing a clear series-level identity for procurement and BOM tracking.
• Memory Type & Format MemoryType is listed as Non-Volatile while MemoryFormat is listed as DRAM; Technology is specified as DDR SDRAM, and MemoryOrganization is 4G × 8.
• Interface MemoryInterface is specified as Parallel, providing the interface style documented in the product data.
• Voltage Supply Specifications list a nominal VoltageSupply of 2.5V. The part number/product name also includes "1.8V/3V" within the series designation.
• Grade Grade is specified as Known Good Die (KGD), indicating the die-level qualification recorded in the product data.
• Regulatory Compliance RoHS Status is listed as Compliant, supporting use in RoHS-directed product designs.

Typical Applications

• Memory Products Listed under the Memory category and Parent Category "Memory Products," this part is positioned for integration within memory product assemblies.
• Known Good Die Integration As a Known Good Die (KGD) product, it is suitable where die-level components are required for downstream packaging or integration workflows.
• RoHS-compliant Designs RoHS compliance makes the device appropriate for product lines that require lead-free and restricted-substance adherence.

Unique Advantages

• Known Good Die (KGD) grading: Provides die-level qualification information useful for high-yield packaging and assembly processes.
• Series-level identity: Part of the ESMT SPI NAND KGD-4Gb-SLC series, simplifying sourcing and lifecycle tracking across related parts.
• Explicit memory organization: The 4G × 8 organization is directly specified, enabling clear capacity planning during system design.
• Parallel interface specification: A parallel memory interface is listed in the product data, allowing designers to plan for compatible board-level integration.
• RoHS compliance: Meets regulatory requirements for restricted substances as documented in the product data.
• Documented electrical reference: A nominal voltage supply value (2.5V) is provided in specifications for power-rail planning.

Why Choose KGD-4Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V?

This ESMT part combines series-level SPI NAND identification with explicit specification points including memory organization (4G × 8), a parallel interface, Known Good Die grading, and RoHS compliance. The product data also records DRAM format and DDR SDRAM technology entries alongside a listed nominal voltage supply of 2.5V, and the part name denotes internal ECC and voltage markers for clear series-level functionality.

Choose this component when die-level qualification, clear series identification, and documented electrical and regulatory attributes are required for procurement, downstream packaging, or memory product integration.

Request a quote or submit an inquiry to receive pricing and availability for the KGD-4Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V. Our team will respond with the next steps for procurement and technical follow-up.