KGD-32Mbx32-LPDDR3-SDRAM-1.2V

LPDDR3 SDRAM KGD
Part Description

LPDDR3 SDRAM 1.2V

Quantity 1,066 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPDDR3 SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization32M x 32
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.32

Overview of KGD-32Mbx32-LPDDR3-SDRAM-1.2V – LPDDR3 SDRAM 1.2V

The KGD-32Mbx32-LPDDR3-SDRAM-1.2V from ESMT is a volatile DRAM device specified as LPDDR3 SDRAM and delivered in Known Good Die (KGD) grade. The device is organized as 32M × 32 with a parallel memory interface and is defined in the product data as a DRAM memory format.

This product is intended for designs that require an LPDDR3 SDRAM architecture in a Known Good Die form factor, enabling direct die-level integration while maintaining compliance with RoHS requirements.

Key Features

  • Memory Technology (LPDDR3 SDRAM) Implemented as LPDDR3 SDRAM according to the product data; provided as volatile DRAM storage.
  • Memory Organization 32M × 32 organization, delivering the capacity and data width specified for this part number.
  • Memory Interface Parallel memory interface as listed in the product specifications for integration at the die level.
  • Voltage Supply Specified supply voltage: 2.5V per the provided product data.
  • Grade — Known Good Die (KGD) Supplied as Known Good Die, enabling die-level integration workflows and qualifying for KGD-specific assembly processes.
  • RoHS Compliance RoHS status: Compliant, per the environmental information in the product data.

Unique Advantages

  • Known Good Die delivery: The KGD grade supports die-level assembly and can align with production flows that require pre-qualified die.
  • Clear memory organization: The 32M × 32 configuration provides predictable capacity and data width for system-level memory planning.
  • Defined interface and supply: A parallel memory interface and a specified 2.5V supply simplify electrical planning and integration.
  • Regulatory alignment: RoHS compliance supports deployment in environments where lead-free materials are required.

Why Choose KGD-32Mbx32-LPDDR3-SDRAM-1.2V?

KGD-32Mbx32-LPDDR3-SDRAM-1.2V combines ESMT's LPDDR3 SDRAM technology with a Known Good Die grade and a 32M × 32 memory organization, offering a die-level memory option with defined electrical and compliance attributes. The part's specified parallel interface and 2.5V supply provide clear integration parameters for system designers.

This part suits development and production environments that require LPDDR3 architecture in a KGD form factor, enabling predictable memory capacity and straightforward electrical integration while adhering to RoHS requirements.

Request a quote or submit an inquiry for pricing and availability for KGD-32Mbx32-LPDDR3-SDRAM-1.2V to begin integration planning and sourcing.

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