MTFC32GJVED-IT TR

IC FLASH 256GBIT MMC 169VFBGA
Part Description

IC FLASH 256GBIT MMC 169VFBGA

Quantity 1,186 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-VFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-VFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GJVED-IT TR – IC FLASH 256GBIT MMC 169VFBGA

The MTFC32GJVED-IT TR is a 256 Gbit non-volatile NAND flash memory device in the e•MMC™ series, provided in a 169‑VFBGA (14×18) package. It implements a MMC memory interface and is organized as 32G × 8, offering high-density embedded flash storage for systems that require an MMC interface.

Key physical and electrical characteristics include a supply voltage range of 2.7 V to 3.6 V and an operating temperature range of −40°C to 85°C, enabling use in applications that require wide voltage tolerance and extended temperature operation.

Key Features

  • Memory Technology NAND flash non-volatile memory providing persistent data storage.
  • Capacity & Organization 256 Gbit capacity organized as 32G × 8 to deliver high-density embedded storage.
  • Interface MMC memory interface for integration into MMC-compatible host controllers.
  • Power Wide supply voltage range of 2.7 V to 3.6 V to accommodate common 3 V system rails.
  • Package & Mounting 169‑VFBGA (14×18) package suitable for board-level surface mounting and compact designs.
  • Operating Temperature Specified operating range of −40°C to 85°C (TA) for extended temperature applications.

Unique Advantages

  • High-density embedded storage: 256 Gbit capacity enables significant on-board data storage within a single device.
  • MMC interface compatibility: Designed for systems that use an MMC memory interface, simplifying host integration.
  • Wide supply voltage window: 2.7 V to 3.6 V support allows operation across common 3 V system power rails.
  • Extended temperature support: −40°C to 85°C operating range addresses designs requiring broader environmental tolerance.
  • Compact VFBGA package: 169‑VFBGA (14×18) package provides a space-efficient footprint for dense PCB layouts.
  • NAND flash technology: Non-volatile FLASH memory provides persistent data retention without external power.

Why Choose MTFC32GJVED-IT TR?

The MTFC32GJVED-IT TR offers a high-capacity, MMC-interface NAND flash solution packaged in a compact 169‑VFBGA format, with supply and temperature specifications that suit a wide range of embedded designs. Its 256 Gbit density and 32G × 8 organization provide substantial on-board storage while maintaining compatibility with MMC-based systems.

This device is suited to designs that require large non-volatile memory capacity in a small package and that operate within the specified 2.7 V–3.6 V supply range and −40°C to 85°C ambient conditions. The e•MMC™ form factor and explicit package dimensions support integration into space-constrained PCB layouts.

Request a quote or contact sales for pricing, lead times, and availability for the MTFC32GJVED-IT TR.

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