MTFC32GJVED-3M WT TR
| Part Description |
IC FLASH 256GBIT MMC 169VFBGA |
|---|---|
| Quantity | 21 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-VFBGA | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJVED-3M WT TR – IC FLASH 256GBIT MMC 169VFBGA
The MTFC32GJVED-3M WT TR is a Micron e•MMC™ non-volatile NAND flash memory device providing 256 Gbit of storage in a 169-VFBGA package. It implements a 32G × 8 memory organization with an MMC interface and operates from a 2.7 V to 3.6 V supply.
With an operating temperature range of −25°C to 85°C, this device is intended for systems that require MMC-format flash storage in a compact BGA package.
Key Features
- Memory Type: Non-volatile NAND flash—provides persistent storage using FLASH - NAND technology.
- Capacity & Organization: 256 Gbit capacity organized as 32G × 8, enabling high-density storage in a single device.
- Interface: MMC memory interface—designed for systems that use the MMC protocol for embedded storage.
- Supply Voltage: 2.7 V to 3.6 V operation—compatible with standard 3 V system power rails.
- Package: 169-VFBGA—compact ball-grid array footprint for space-constrained board designs.
- Temperature Range: −25°C to 85°C (TA)—specified operating range for typical commercial environments.
Typical Applications
- MMC-based storage systems — Use where an MMC interface is required for non-volatile flash storage implementation.
- Embedded storage modules — Integrate as onboard NAND flash memory in designs that need 256 Gbit capacity in a compact package.
- Systems with 3 V supply rails — Suitable for devices operating within a 2.7 V to 3.6 V supply range and requiring persistent data storage.
Unique Advantages
- High-density storage: 256 Gbit capacity in a single device reduces the need for multiple parts to achieve large storage sizes.
- Standard MMC interface: Simplifies integration into systems designed for MMC-format memory without requiring custom interfaces.
- Compact BGA package: 169-VFBGA package allows high-density board layouts and saves PCB real estate.
- Wide supply voltage tolerance: 2.7 V to 3.6 V operation supports common system power rails and reduces power-rail constraints.
- Commercial temperature range: −25°C to 85°C specification supports deployment in typical commercial applications.
Why Choose IC FLASH 256GBIT MMC 169VFBGA?
The MTFC32GJVED-3M WT TR combines Micron's NAND FLASH technology with an MMC interface and a compact 169-VFBGA package to provide a straightforward, high-density non-volatile storage option. Its voltage and temperature specifications make it suitable for designs that require reliable MMC-format flash within standard commercial operating conditions.
This device is a fit for engineers and procurement teams looking for a single-device 256 Gbit storage solution from Micron Technology Inc., offering straightforward integration into MMC-based designs and long-term availability tied to an established memory manufacturer.
Request a quote or submit an inquiry for MTFC32GJVED-3M WT TR to check availability, lead times, and pricing for your project.
