MTFC32GJUEF-AIT

IC FLASH 256GBIT MMC 169TFBGA
Part Description

IC FLASH 256GBIT MMC 169TFBGA

Quantity 745 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-TFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GJUEF-AIT – IC FLASH 256GBIT MMC 169TFBGA

The MTFC32GJUEF-AIT is a 256 Gbit non-volatile NAND flash memory organized as 32G × 8, supplied in a 169-TFBGA (14×18) package. It implements an MMC memory interface and belongs to the e•MMC™ series, providing high-density flash storage in a compact BGA footprint.

With a specified operating temperature range of −40°C to 85°C and a supply voltage of 2.7 V to 3.6 V, this device is intended for systems that require a solid-state MMC flash memory solution with straightforward integration into MMC-compatible designs.

Key Features

  • Memory Type & Technology  Non-volatile FLASH memory using NAND technology, organized as 32G × 8 for a total capacity of 256 Gbit.
  • Memory Interface  MMC memory interface for integration into MMC-compatible host controllers and designs.
  • Voltage Supply  Operates from 2.7 V to 3.6 V, supporting common system power rails for flash storage devices.
  • Package  169-TFBGA (14×18) Ball Grid Array package for compact board-level integration.
  • Operating Temperature  Rated for −40°C to 85°C (TA), accommodating a wide ambient temperature range.
  • Memory Format & Series  FLASH memory format in the e•MMC™ series, providing a standardized MMC-based storage option.

Unique Advantages

  • High storage density: 256 Gbit NAND flash capacity provides large on-board non-volatile storage in a single component.
  • MMC interface integration: Built with an MMC memory interface to simplify connectivity with MMC-capable hosts and controllers.
  • Compact BGA package: 169-TFBGA (14×18) package reduces PCB area compared with larger discrete arrangements.
  • Wide supply range: 2.7 V to 3.6 V support enables use across common system power rails.
  • Broad operating temperature: Specified −40°C to 85°C to support designs exposed to extended ambient temperature ranges.
  • Manufacturer-backed device: Supplied by Micron Technology Inc., a known memory supplier for FLASH NAND devices.

Why Choose IC FLASH 256GBIT MMC 169TFBGA?

The MTFC32GJUEF-AIT positions itself as a high-density, e•MMC™-based NAND flash memory solution that balances large on-board capacity with a compact 169-TFBGA package. Its MMC interface and defined electrical and thermal operating ranges simplify integration into systems that require reliable non-volatile storage at 256 Gbit capacity.

This device is suited to designs that need substantial flash capacity within a BGA form factor and that operate within the specified 2.7 V–3.6 V supply and −40°C to 85°C ambient range. Backed by Micron Technology Inc., it offers a standardized MMC flash option for projects emphasizing storage density and package integration.

Request a quote or contact sales to receive pricing, availability, and lead-time information for the MTFC32GJUEF-AIT.

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