MTFC32GJGEF-AIT Z TR
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 1,198 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJGEF-AIT Z TR – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GJGEF-AIT Z TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It provides on-board MMC interface storage in a 169-TFBGA (14×18) package for systems that require high-density flash in a compact form factor.
Designed as flash memory storage, this device targets applications and designs that need MMC-compatible NAND flash with a 2.7 V to 3.6 V supply range and an operating temperature range of −40°C to 85°C.
Key Features
- Memory Type & Technology Non-volatile FLASH based on NAND technology for persistent data storage.
- Density & Organization 256 Gbit total memory capacity organized as 32G × 8 to deliver high-density storage in a single-package solution.
- Interface MMC interface implementation as part of the e•MMC™ series for integration with MMC-compatible hosts.
- Voltage Supply Operates from 2.7 V to 3.6 V, supporting typical host supply ranges for embedded systems.
- Package 169-TFBGA package (14×18 mm footprint) to support compact board-level integration.
- Temperature Range Specified for operation from −40°C to 85°C (TA), enabling use across a wide ambient range.
Typical Applications
- Embedded Storage — On-board non-volatile storage for embedded systems that require MMC-compatible NAND flash with large capacity.
- System Firmware and OS Storage — Store firmware, boot images, and operating system components using the e•MMC interface and 256 Gbit capacity.
- Data Logging — High-capacity flash for devices that accumulate large amounts of data and require persistent storage within the specified temperature and voltage ranges.
Unique Advantages
- High Density in Compact Package: 256 Gbit NAND flash in a 169-TFBGA (14×18) package reduces board area for high-capacity storage needs.
- Standard MMC Interface: e•MMC™/MMC interface simplifies integration with MMC-compatible host controllers.
- Wide Operating Voltage: 2.7 V to 3.6 V supply compatibility supports common embedded power domains.
- Wide Temperature Range: −40°C to 85°C operating range supports deployment across a variety of ambient conditions.
- NAND FLASH Technology: Non-volatile NAND flash provides persistent storage suitable for firmware, data, and system images.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The MTFC32GJGEF-AIT Z TR combines high-density 256 Gbit NAND flash with an MMC interface and a compact 169-TFBGA package to address designs that need significant on-board non-volatile storage in a small footprint. Its 2.7 V to 3.6 V supply range and −40°C to 85°C operating temperature make it suitable for a range of embedded environments.
This device is appropriate for engineers and procurement teams specifying MMC-compatible flash memory for firmware storage, system images, or data logging where capacity, package density, and standard interface compatibility are primary considerations.
Request a quote or submit an inquiry to receive pricing and availability information for the MTFC32GJGEF-AIT Z TR.
