MTFC32GJGEF-AIT Z
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 138 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 |
Overview of MTFC32GJGEF-AIT Z – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GJGEF-AIT Z is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It is organized as 32G × 8 and implements an MMC memory interface for board-level embedded storage integration.
Designed for systems that require high-density flash storage in a compact package, this device provides a defined operating voltage range and extended ambient temperature support to match a variety of MMC-based designs.
Key Features
- Memory Core 256 Gbit NAND flash organized as 32G × 8 providing high-density non-volatile storage.
- Interface MMC memory interface for direct integration into MMC-compatible host designs.
- Technology FLASH - NAND technology for persistent data storage.
- Voltage Supply Operates across a 2.7 V to 3.6 V supply range to match common MMC power domains.
- Package 169-TFBGA (14 × 18) supplier device package for board-level mounting and compact footprint.
- Operating Temperature Specified for ambient operation from −40°C to 85°C (TA).
Typical Applications
- MMC-based embedded systems Provides high-density storage where an MMC interface is required for system memory.
- Board-level flash modules Suitable for integration onto PCBs that incorporate 169-TFBGA memory devices.
- Systems requiring wide voltage compatibility Fits designs operating within a 2.7 V to 3.6 V supply window.
Unique Advantages
- High storage density: 256 Gbit capacity (32G × 8) enables large-volume data and file storage on a single device.
- Standard MMC interface: Simplifies integration into MMC-compatible host controllers and platforms.
- Wide voltage range: 2.7 V to 3.6 V operation supports common power rails without additional regulation.
- Compact BGA package: 169-TFBGA (14 × 18) footprint conserves board area for space-constrained designs.
- Extended ambient temperature: −40°C to 85°C rating supports deployment across a range of environmental conditions.
- e•MMC™ series consistency: Part of Micron's e•MMC™ offering for predictable integration and supply chain planning.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The MTFC32GJGEF-AIT Z pairs 256 Gbit NAND flash density with an MMC interface in a compact 169-TFBGA package, delivering a straightforward embedded storage option for MMC-compatible designs. Its defined voltage range (2.7 V–3.6 V) and −40°C to 85°C ambient rating make it suitable for systems that require robust, board-mounted non-volatile memory.
This device is well suited to engineers and procurement teams specifying high-capacity flash for integration at the board level, offering clear electrical and mechanical parameters to simplify design, qualification, and supply planning.
To request pricing, availability, or submit a quote inquiry for the MTFC32GJGEF-AIT Z, please request a quote or contact sales with your quantity and delivery requirements.
