MTFC32GJDED-4M IT TR

IC FLASH 256GBIT MMC 169VFBGA
Part Description

IC FLASH 256GBIT MMC 169VFBGA

Quantity 1,121 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-VFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.65V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-VFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GJDED-4M IT TR – IC FLASH 256GBIT MMC 169VFBGA

The MTFC32GJDED-4M IT TR is a 256 Gbit non-volatile flash memory device based on NAND technology and organized as 32G × 8. It implements an MMC memory interface in a compact 169‑VFBGA (14 × 18) package.

This device supports a supply voltage range of 1.65 V to 3.6 V and an operating ambient temperature range of −40 °C to 85 °C, making it suitable for systems that require high-density embedded flash with MMC connectivity and a compact board-level footprint.

Key Features

  • Memory Technology  NAND flash non-volatile memory format for persistent data storage.
  • Capacity & Organization  256 Gbit total capacity, organized as 32G × 8 to provide byte-wide access and addressable density.
  • Interface  MMC memory interface for integration with MMC-compatible host controllers and designs.
  • Voltage Supply  Operates across a wide supply range of 1.65 V to 3.6 V to support varied system voltage domains.
  • Package  169‑VFBGA package (14 × 18) for a compact board footprint and board-level mounting.
  • Temperature Range  Specified operating ambient temperature of −40 °C to 85 °C for temperature-tolerant applications.

Typical Applications

  • Embedded storage implementations  Use where MMC interface and high-density non-volatile flash are required for system firmware or data storage.
  • Compact board-level systems  Suited to designs that require a small package footprint provided by the 169‑VFBGA (14 × 18) package.
  • Voltage-flexible designs  Applicable to systems operating within the 1.65 V to 3.6 V supply range.

Unique Advantages

  • High-density storage: 256 Gbit capacity enables greater data and firmware storage in a single device.
  • MMC interface compatibility: MMC interface simplifies integration with MMC-capable controllers and existing MMC designs.
  • Wide supply voltage range: 1.65 V to 3.6 V operation supports multiple system voltage rails without additional level translation.
  • Compact VFBGA package: 169‑VFBGA (14 × 18) package reduces board area for space-constrained designs.
  • Extended operating temperature: −40 °C to 85 °C rating supports deployments across a broad ambient temperature range.
  • Byte-wide memory organization: 32G × 8 organization provides a straightforward memory layout for byte-oriented accesses.

Why Choose MTFC32GJDED-4M IT TR?

The MTFC32GJDED-4M IT TR combines high-density NAND flash storage with an MMC interface and a compact 169‑VFBGA package, offering a practical solution for systems that need substantial non-volatile memory in a small form factor. Its wide supply voltage window and extended operating temperature range make it adaptable to a variety of board-level environments.

This device is appropriate for designers seeking a high-capacity, MMC-interface flash component with clear electrical and mechanical specifications. It provides long-term value through high storage density, a standard MMC interface, and a compact package suitable for constrained PCB layouts.

Request a quote or contact sales to discuss pricing, availability, and integration details for the MTFC32GJDED-4M IT TR.

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