MTFC32GJDED-4M IT
| Part Description |
IC FLASH 256GBIT MMC 169VFBGA |
|---|---|
| Quantity | 126 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-VFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.65V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJDED-4M IT – IC FLASH 256GBIT MMC 169VFBGA
The MTFC32GJDED-4M IT is a 256 Gbit non-volatile FLASH memory device in Micron's e•MMC™ series, organized as 32G × 8 and presented with an MMC interface. It integrates NAND flash storage in a 169-VFBGA (14×18) package.
Designed for MMC-based storage implementations, the device offers a wide supply voltage range of 1.65 V to 3.6 V and an operating temperature range of -40°C to 85°C, providing flexibility for designs that require substantial on-board non-volatile capacity in a compact package.
Key Features
- Memory Core 256 Gbit total capacity organized as 32G × 8 using FLASH NAND technology for non-volatile storage.
- Interface MMC memory interface for integration into MMC/e•MMC-based storage systems.
- Voltage Wide supply range from 1.65 V to 3.6 V to support various system power domains.
- Temperature Range Operating temperature specified from -40°C to 85°C (TA) to accommodate a range of environmental conditions.
- Package 169-VFBGA package (14×18) for compact board-level integration and high-density placement.
- Memory Format & Organization FLASH memory format with NAND technology and 32G × 8 organization for high-density on-board storage.
Typical Applications
- MMC/e•MMC storage Implements high-capacity MMC-based storage for systems that require on-board non-volatile memory with an MMC interface.
- On-board system memory Provides large flash storage capacity for systems needing integrated non-volatile data or code storage.
- Compact module integration The 169-VFBGA package supports compact PCB designs where board space and high memory density are priorities.
Unique Advantages
- High capacity (256 Gbit): Substantial on-board storage in a single device reduces the need for multiple memory components.
- MMC interface compatibility: Native MMC interface simplifies integration into MMC/e•MMC-based designs.
- Wide supply voltage: 1.65 V to 3.6 V operation enables flexibility across different power architectures.
- Extended operating temperature: Rated for -40°C to 85°C to support designs exposed to a broad temperature range.
- Compact VFBGA package: 169-VFBGA (14×18) footprint enables high-density placement and space-efficient board layouts.
Why Choose IC FLASH 256GBIT MMC 169VFBGA?
The MTFC32GJDED-4M IT combines high-capacity NAND flash with an MMC interface and a compact 169-VFBGA package, offering a straightforward solution for designs that require large on-board non-volatile storage. Its wide voltage supply range and specified -40°C to 85°C operating window make it suitable for systems where power flexibility and environmental range are important considerations.
This device is appropriate for engineers and procurement teams seeking a high-density MMC flash memory component that simplifies board-level integration while delivering verifiable capacity and interface characteristics.
Request a quote or contact sales to discuss availability, pricing, and lead time for the MTFC32GJDED-4M IT.
