MTFC32GBCAQTC-WT
| Part Description |
EMMC 256GBIT 153/196 LFBGA WT |
|---|---|
| Quantity | 577 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-LFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GBCAQTC-WT – e•MMC™ 256 Gbit, 153-LFBGA
The MTFC32GBCAQTC-WT is a 256 Gbit non-volatile memory device in the Micron e•MMC™ series, implemented with FLASH - NAND (SLC) technology and organized as 32G × 8. It provides onboard e•MMC_5.1 interface storage with a 200 MHz clock frequency for embedded storage implementations.
Packaged in a 153‑LFBGA (11.5 × 13 mm) and specified for an operating temperature range of -25°C to 85°C, the device is designed for compact systems requiring high-density, soldered non-volatile memory with a 2.7 V to 3.6 V supply range.
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND (SLC) memory offering persistent storage suitable for embedded applications.
- Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 to present a single e•MMC logical storage device.
- Interface e•MMC_5.1 memory interface providing standardized onboard storage connectivity.
- Performance 200 MHz clock frequency for e•MMC operation.
- Power Supply Operates from a 2.7 V to 3.6 V supply range for compatibility with common system power rails.
- Package 153‑LFBGA package (11.5 × 13 mm) for compact, board-mounted integration.
- Operating Temperature Specified operating temperature range of -25°C to 85°C (TC).
Typical Applications
- Embedded Storage Onboard non-volatile storage in devices that require an e•MMC_5.1 interface.
- Firmware and System Image Storage Storage of firmware, operating system images or system partitions using the 256 Gbit capacity.
- Space-Constrained Hardware Compact 153‑LFBGA package suits designs with limited board area requiring soldered flash memory.
Unique Advantages
- High Density Capacity: 256 Gbit provides extensive onboard storage without external memory modules.
- Standard e•MMC_5.1 Interface: Integrates via a standardized e•MMC_5.1 interface to simplify storage subsystem design.
- SLC NAND Technology: FLASH - NAND (SLC) technology is used for the memory array.
- Wide Voltage Range: 2.7 V to 3.6 V operation enables compatibility with common system power rails.
- Compact LFBGA Package: 153‑LFBGA (11.5 × 13 mm) package supports dense PCB layouts and surface-mount assembly.
- Extended Operating Temperature: Rated for -25°C to 85°C to accommodate a range of environmental conditions.
Why Choose EMMC 256GBIT 153/196 LFBGA WT?
The MTFC32GBCAQTC-WT positions as a compact, high-density e•MMC_5.1 storage option combining 256 Gbit capacity, SLC NAND technology, and a standardized interface. Its 153‑LFBGA package and 2.7 V–3.6 V supply compatibility make it suitable for board-mounted embedded designs that require soldered, non-volatile storage within the specified temperature range.
This device is appropriate for design teams seeking a packaged e•MMC solution that balances capacity and integration, supporting system configurations where onboard, high-density flash is required and space is constrained.
Request a quote or submit an RFQ to receive pricing and availability information for the MTFC32GBCAQTC-WT.
