MTFC32GBCAQTC-AAT
| Part Description |
EMMC 256GBIT 153/196 LFBGA AT |
|---|---|
| Quantity | 177 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-LFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C | Write Cycle Time Word Page | N/A | Packaging | 153-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | N/A | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GBCAQTC-AAT – EMMC 256GBIT 153/196 LFBGA AT
The MTFC32GBCAQTC-AAT is a non-volatile flash memory device in Micron's e•MMC™ series, delivering 256 Gbit of storage implemented as 32G × 8. It uses FLASH - NAND (SLC) technology and is supplied in a 153-LFBGA package.
Designed for environments that require qualified components and wide temperature tolerance, this device targets applications needing high-density embedded storage with automotive-grade qualification and board-level package integration.
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND (SLC) memory offering single-level cell architecture for the specified 256 Gbit capacity.
- Memory Organization & Capacity Organized as 32G × 8 to provide a total of 256 Gbit of embedded storage.
- Qualification AEC-Q100 qualification, indicating suitability for applications requiring this level of component qualification.
- Package 153-LFBGA package, listed as 153-LFBGA (11.5×13), for compact board-level integration.
- Operating Temperature Range Rated for −40°C to 105°C to support wide-temperature applications.
- Grade Automotive grade as specified in the product data.
Typical Applications
- Automotive electronic systems Use as embedded non-volatile storage in automotive designs that require components with AEC-Q100 qualification.
- Temperature-sensitive embedded designs Applications operating across a wide temperature range (−40°C to 105°C) where stable storage is required.
- Compact or space-constrained boards Systems that benefit from the 153-LFBGA package footprint for high-density storage in limited PCB area.
Unique Advantages
- Automotive-Grade Qualification: AEC-Q100 qualification supports use in circuits requiring this component-level credential.
- High Storage Density: 256 Gbit capacity provided as 32G × 8 to meet high-capacity embedded storage requirements.
- SLC NAND FLASH Technology: FLASH - NAND (SLC) implementation aligns with single-level cell memory architecture specified for this device.
- Wide Operating Temperature: Rated from −40°C to 105°C for reliable operation across broad environmental conditions.
- Compact LFBGA Package: Supplied in a 153-LFBGA (11.5×13) package for efficient board-level integration.
- Manufacturer Provenance: Offered by Micron Technology Inc., as indicated in the product data.
Why Choose MTFC32GBCAQTC-AAT?
The MTFC32GBCAQTC-AAT positions itself as a high-density, automotive-grade e•MMC™ storage option with SLC NAND FLASH implementation and a compact 153-LFBGA package. Its 256 Gbit capacity and AEC-Q100 qualification make it suitable for designs that require qualified components and wide temperature operation.
This device is appropriate for engineers and procurement teams specifying embedded storage for automotive and other temperature-demanding systems where board-area efficiency, defined memory organization, and supplier traceability are required.
Request a quote or submit an inquiry to receive pricing and availability information for the MTFC32GBCAQTC-AAT.
