MTFC32GAZAQHD-WT TR
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 524 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAZAQHD-WT TR – IC FLASH 256GBIT MMC 153VFBGA
The MTFC32GAZAQHD-WT TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It implements FLASH NAND (SLC) organized as 32G × 8 and presents a managed eMMC_5.1 interface for embedded storage integration.
Packaged in a 153‑VFBGA (11.5 × 13 mm) footprint, the device supports a 200 MHz clock and operates from a 2.7 V to 3.6 V supply across an ambient temperature range of −25°C to 85°C, making it suitable for designs that require compact, high-density managed flash storage.
Key Features
- Memory Technology Non-volatile FLASH NAND (SLC) memory technology providing a 256 Gbit capacity organized as 32G × 8.
- Managed Interface e•MMC™ series device with an eMMC_5.1 memory interface for system-level managed flash access.
- Performance Supports a 200 MHz clock frequency for host interface timing.
- Power Operates from a 2.7 V to 3.6 V supply voltage range to accommodate common embedded power rails.
- Temperature Range Rated for ambient operation from −25°C to 85°C (TA).
- Package 153‑VFBGA package (11.5 × 13 mm) for compact board-level integration.
Typical Applications
- Embedded storage systems Managed eMMC_5.1 interface and 256 Gbit capacity provide scalable flash storage for embedded devices that require onboard non-volatile memory.
- Industrial equipment Wide operating temperature range and a compact VFBGA package support integration into industrial control and instrumentation platforms.
- Consumer electronics High-density managed flash in a small footprint enables storage integration in consumer devices where board space is limited.
Unique Advantages
- High-density storage: 256 Gbit (32G × 8) capacity enables substantial onboard data storage within a single device.
- Managed eMMC interface: eMMC_5.1 simplifies host integration by providing a standard managed-NAND interface.
- Compact package: 153‑VFBGA (11.5 × 13 mm) minimizes board area while supporting high-density flash.
- Flexible power range: 2.7 V to 3.6 V supply compatibility with common embedded power domains.
- Extended ambient operation: −25°C to 85°C rating supports deployment across a broad set of ambient conditions.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The MTFC32GAZAQHD-WT TR delivers managed, high-density NAND flash storage in a compact VFBGA package with an eMMC_5.1 interface, a 200 MHz clock capability, and a 2.7–3.6 V operating range. These characteristics make it a practical option for designs needing integrated, board-level non-volatile storage with standardized host interfacing.
Manufactured by Micron Technology Inc., the device suits customers who require a packaged e•MMC™ solution with clear electrical and environmental specifications for embedded system integration.
Request a quote or contact sales for pricing, lead times, and availability for the MTFC32GAZAQHD-WT TR.
