MTFC32GBCAQTC-IT

EMMC 256GBIT 153/196 LFBGA IT
Part Description

EMMC 256GBIT 153/196 LFBGA IT

Quantity 546 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package153-LFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-LFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GBCAQTC-IT – EMMC 256GBIT 153/196 LFBGA IT

The MTFC32GBCAQTC-IT is a Micron Technology Inc. e•MMC™ non-volatile flash memory device with a 256 Gbit capacity. It implements NAND (TLC) flash in a 32G x 8 organization and provides an eMMC_5.1 memory interface.

Designed for integration into systems requiring onboard flash storage, the device offers a 200 MHz clock frequency, a 2.7 V to 3.6 V supply range, and a 153‑LFBGA (11.5×13 mm) package with an operating temperature range of −40°C to 95°C.

Key Features

  • Memory Type & Technology  Non-volatile FLASH using NAND (TLC) technology with a total memory size of 256 Gbit organized as 32G × 8.
  • Interface  eMMC_5.1 memory interface for standard e•MMC host implementations.
  • Clock  200 MHz clock frequency specified for device timing.
  • Power  Wide operating supply voltage from 2.7 V to 3.6 V to match common embedded power rails.
  • Package & Footprint  153‑LFBGA package (11.5 × 13 mm) for compact board-level integration.
  • Operating Temperature  Specified operating temperature range of −40°C to 95°C (TC).
  • Memory Format & Mounting  FLASH memory format provided as a mounted, surface-mount LFBGA device.

Typical Applications

  • Systems with eMMC_5.1 host interfaces  Acts as onboard non-volatile storage where an eMMC_5.1 interface is required.
  • Space-constrained PCB designs  The 153‑LFBGA (11.5×13 mm) package supports compact board layouts and surface-mount assembly.
  • Extended-temperature equipment  Suitable for deployments that require operation across −40°C to 95°C.

Unique Advantages

  • High-density storage: 256 Gbit capacity (32G × 8) provides substantial onboard flash in a single package.
  • Standardized host interface: eMMC_5.1 compatibility simplifies integration with hosts supporting the e•MMC™ standard.
  • Wide supply range: 2.7 V to 3.6 V operation aligns with common embedded system power supplies.
  • Compact LFBGA package: 153‑LFBGA (11.5×13 mm) minimizes PCB footprint while maintaining surface-mount reliability.
  • Broad temperature capability: −40°C to 95°C operating range supports deployments across varied thermal environments.

Why Choose EMMC 256GBIT 153/196 LFBGA IT?

The MTFC32GBCAQTC-IT combines Micron's e•MMC™ implementation with 256 Gbit TLC NAND in a compact 153‑LFBGA package, offering a straightforward eMMC_5.1 storage option for systems that need high-density onboard flash. Its 200 MHz clock, 2.7–3.6 V supply range, and −40°C to 95°C operating range align with common embedded system requirements.

This device is suited for designs that require a standardized eMMC interface, a compact footprint, and extended temperature operation, providing a verifiable specification set for procurement and integration into embedded platforms.

Request a quote or submit an availability inquiry for MTFC32GBCAQTC-IT to receive pricing and lead-time information from our team.

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