MTFC32GJGDQ-AIT TR

IC FLASH 256GBIT MMC 100LBGA
Part Description

IC FLASH 256GBIT MMC 100LBGA

Quantity 1,796 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-LBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GJGDQ-AIT TR – IC FLASH 256Gbit e•MMC 100-LBGA

The MTFC32GJGDQ-AIT TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC series, provided in a 100-LBGA (14×18) package. It implements a 32G × 8 memory organization with an MMC interface designed for board-level embedded storage.

This device targets designs that require high-density flash in a compact package, operating across a 2.7 V to 3.6 V supply range and an ambient temperature range of -40°C to 85°C.

Key Features

  • Memory Type & Technology  Non-volatile NAND flash memory formatted as FLASH, providing persistent storage without external power.
  • Capacity & Organization  256 Gbit total capacity organized as 32G × 8, enabling large on-board data storage.
  • Interface  MMC memory interface for host connectivity using standard MMC signaling.
  • Power  Operates from a 2.7 V to 3.6 V supply range, compatible with typical 3.3 V system rails.
  • Package  Supplied in a 100-LBGA package (14×18), suitable for compact PCB implementations.
  • Operating Temperature  Rated for ambient operation from -40°C to 85°C (TA).
  • Manufacturer & Series  Micron Technology Inc., e•MMC series.

Typical Applications

  • Embedded non-volatile storage  Use where board-level NAND flash is required for system code, file systems, or large data storage on MMC hosts.
  • MMC interface-based designs  Integration into systems that leverage an MMC host controller for onboard memory functions.
  • Space-constrained board layouts  Deployments needing 256 Gbit capacity in a 100-LBGA (14×18) footprint to minimize PCB area.

Unique Advantages

  • High-density storage: 256 Gbit capacity supports larger data and application storage directly on the board.
  • Compact package: 100-LBGA (14×18) package enables dense mounting and reduced board area compared to discrete solutions.
  • Standard MMC interface: MMC connectivity simplifies integration with hosts designed for MMC memory.
  • Wide operating voltage: 2.7 V–3.6 V supply range accommodates common 3.3 V system power rails.
  • Extended ambient temperature range: -40°C to 85°C rating supports a broad set of environmental conditions.
  • Micron e•MMC series: Part of Micron's e•MMC lineup for consistent form-factor and interface expectations.

Why Choose IC FLASH 256GBIT MMC 100LBGA?

The MTFC32GJGDQ-AIT TR positions itself as a high-density, board-level e•MMC NAND flash solution that balances capacity, compact packaging, and broad operating conditions. Its 256 Gbit capacity and 32G × 8 organization provide substantial onboard storage while the 100-LBGA package supports space-constrained designs.

This device is suited for customers and designs that require MMC-interface flash memory with a 2.7 V–3.6 V supply range and an ambient operating window from -40°C to 85°C, delivering a straightforward integration path for embedded storage needs.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the MTFC32GJGDQ-AIT TR.

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