MTFC32GJGDQ-AIT Z
| Part Description |
IC FLASH 256GBIT MMC 100LBGA |
|---|---|
| Quantity | 709 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJGDQ-AIT Z – IC FLASH 256GBIT MMC 100LBGA
The MTFC32GJGDQ-AIT Z is a non-volatile NAND flash memory device organized as 32G × 8 for a total capacity of 256 Gbit. It implements an MMC memory interface and operates across a standard single-supply voltage range.
This device targets systems that require high-density NAND flash storage in a compact 100-LBGA (14×18) package, with support for extended ambient temperatures.
Key Features
- Memory Core 256 Gbit FLASH - NAND memory organized as 32G × 8, providing high-density non-volatile storage.
- Interface MMC memory interface for host connectivity.
- Power Single-supply operation over a 2.7 V to 3.6 V range to match common system power rails.
- Package 100-LBGA package (14×18 mm) suitable for space-constrained PCB layouts.
- Operating Temperature Rated for −40°C to 85°C (TA), enabling use across a wide ambient temperature range.
Typical Applications
- MMC-based host systems Provides high-capacity non-volatile storage for devices that support an MMC memory interface.
- Space-constrained designs The 100-LBGA (14×18) package fits compact PCBs where board area is limited.
- Extended-temperature equipment Suitable for systems that require operation from −40°C to 85°C.
Unique Advantages
- High-density storage: 256 Gbit capacity (32G × 8) enables large data and filesystem storage within a single device.
- Standard MMC interface: Simplifies integration into host designs that accept MMC memory devices.
- Wide supply voltage compatibility: 2.7 V–3.6 V operation aligns with common system power rails for flexible power design.
- Compact BGA footprint: 100-LBGA (14×18) package reduces PCB area while providing a solderable surface-mount solution.
- Broad ambient temperature range: −40°C to 85°C rating supports deployment in varied thermal environments.
Why Choose IC FLASH 256GBIT MMC 100LBGA?
The IC FLASH 256GBIT MMC 100LBGA delivers a high-density NAND flash solution with a standard MMC interface and broad operating conditions. Its combination of 256 Gbit capacity, compact 100-LBGA package, and 2.7 V–3.6 V supply range makes it suitable for designs that need substantial non-volatile storage in a small form factor.
This device is appropriate for engineers specifying MMC flash memory for applications requiring extended ambient temperature operation and a proven NAND architecture, offering straightforward integration into systems that accept MMC memory modules.
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