MTFC32GJVED-3F WT
| Part Description |
IC FLASH 256GBIT MMC 169VFBGA |
|---|---|
| Quantity | 1,229 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-VFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJVED-3F WT – e•MMC™ 256 Gbit NAND Flash, 169-VFBGA
The MTFC32GJVED-3F WT is a 256 Gbit non-volatile flash memory device in the e•MMC™ series, organized as 32G × 8 and implemented with NAND flash technology. It provides onboard MMC interface connectivity in a 169-VFBGA (14 × 18) package.
Designed for systems that require MMC-interface non-volatile storage, this device operates from a 2.7 V to 3.6 V supply and supports an ambient temperature range of -25°C to 85°C, offering a high-density storage option in a compact BGA footprint.
Key Features
- Core / Memory Architecture 256 Gbit storage capacity, organized as 32G × 8 using NAND flash technology for non-volatile data retention.
- Interface MMC memory interface for integration into MMC-compatible host controllers and systems.
- Voltage / Power Operates from 2.7 V to 3.6 V, enabling compatibility with standard 3.3 V systems.
- Package 169-VFBGA (14 × 18) package provides a compact, ball-grid-array footprint for board-level integration.
- Temperature Range Rated for operation from -25°C to 85°C (TA), supporting a range of ambient operating conditions.
- Memory Format FLASH memory format suitable for persistent storage and data retention in embedded designs.
Typical Applications
- MMC-interface embedded systems — Use where MMC connectivity is required for onboard non-volatile storage.
- Firmware and image storage — Store firmware, system images, or large data assets that require high-density flash.
- Data logging and retention — Retain recorded data in systems that need persistent NAND flash storage.
Unique Advantages
- High-density storage in a compact package: 256 Gbit capacity in a 169-VFBGA footprint reduces board space for large storage needs.
- Standard MMC interface: Simplifies integration into MMC-capable host designs and reduces interface engineering.
- Wide supply voltage range: 2.7 V to 3.6 V operation supports common 3.3 V system rails for flexible power design.
- Broad operating temperature: -25°C to 85°C rating facilitates use across varied ambient conditions.
- Manufacturer backing: Part of the Micron Technology Inc. e•MMC™ series, with clear manufacturer identification for sourcing and support.
Why Choose IC FLASH 256GBIT MMC 169VFBGA
The IC FLASH 256GBIT MMC 169VFBGA (MTFC32GJVED-3F WT) positions itself as a high-density e•MMC™ NAND flash option that balances capacity, standard MMC interfacing, and a compact 169-VFBGA package. Its defined voltage range and operating temperature make it suitable for designs that need reliable, onboard non-volatile storage within those electrical and thermal limits.
This device is appropriate for engineers and procurement teams specifying MMC-based storage where 256 Gbit capacity and a small BGA footprint are required. The explicit memory organization and packaging details support predictable integration and long-term deployment planning.
If you would like pricing, lead-time, or availability information for MTFC32GJVED-3F WT, request a quote or submit an inquiry referencing the part number to receive a formal response.