MTFC32GJVED-3F WT

IC FLASH 256GBIT MMC 169VFBGA
Part Description

IC FLASH 256GBIT MMC 169VFBGA

Quantity 1,229 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-VFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-VFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC32GJVED-3F WT – e•MMC™ 256 Gbit NAND Flash, 169-VFBGA

The MTFC32GJVED-3F WT is a 256 Gbit non-volatile flash memory device in the e•MMC™ series, organized as 32G × 8 and implemented with NAND flash technology. It provides onboard MMC interface connectivity in a 169-VFBGA (14 × 18) package.

Designed for systems that require MMC-interface non-volatile storage, this device operates from a 2.7 V to 3.6 V supply and supports an ambient temperature range of -25°C to 85°C, offering a high-density storage option in a compact BGA footprint.

Key Features

  • Core / Memory Architecture 256 Gbit storage capacity, organized as 32G × 8 using NAND flash technology for non-volatile data retention.
  • Interface MMC memory interface for integration into MMC-compatible host controllers and systems.
  • Voltage / Power Operates from 2.7 V to 3.6 V, enabling compatibility with standard 3.3 V systems.
  • Package 169-VFBGA (14 × 18) package provides a compact, ball-grid-array footprint for board-level integration.
  • Temperature Range Rated for operation from -25°C to 85°C (TA), supporting a range of ambient operating conditions.
  • Memory Format FLASH memory format suitable for persistent storage and data retention in embedded designs.

Typical Applications

  • MMC-interface embedded systems — Use where MMC connectivity is required for onboard non-volatile storage.
  • Firmware and image storage — Store firmware, system images, or large data assets that require high-density flash.
  • Data logging and retention — Retain recorded data in systems that need persistent NAND flash storage.

Unique Advantages

  • High-density storage in a compact package: 256 Gbit capacity in a 169-VFBGA footprint reduces board space for large storage needs.
  • Standard MMC interface: Simplifies integration into MMC-capable host designs and reduces interface engineering.
  • Wide supply voltage range: 2.7 V to 3.6 V operation supports common 3.3 V system rails for flexible power design.
  • Broad operating temperature: -25°C to 85°C rating facilitates use across varied ambient conditions.
  • Manufacturer backing: Part of the Micron Technology Inc. e•MMC™ series, with clear manufacturer identification for sourcing and support.

Why Choose IC FLASH 256GBIT MMC 169VFBGA

The IC FLASH 256GBIT MMC 169VFBGA (MTFC32GJVED-3F WT) positions itself as a high-density e•MMC™ NAND flash option that balances capacity, standard MMC interfacing, and a compact 169-VFBGA package. Its defined voltage range and operating temperature make it suitable for designs that need reliable, onboard non-volatile storage within those electrical and thermal limits.

This device is appropriate for engineers and procurement teams specifying MMC-based storage where 256 Gbit capacity and a small BGA footprint are required. The explicit memory organization and packaging details support predictable integration and long-term deployment planning.

If you would like pricing, lead-time, or availability information for MTFC32GJVED-3F WT, request a quote or submit an inquiry referencing the part number to receive a formal response.

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