MTFC32GJUEF-AIT TR
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 353 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJUEF-AIT TR – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GJUEF-AIT TR is a 256 Gbit non-volatile NAND flash memory organized as 32G × 8 with an MMC memory interface. It is supplied in a compact 169-TFBGA (14 × 18) package and operates from a 2.7 V to 3.6 V supply.
This device is suited for systems that require high-density MMC flash storage with a broad operating temperature range (‑40 °C to 85 °C) and a compact package for space-constrained designs.
Key Features
- Memory Core 256 Gbit NAND flash memory organized as 32G × 8 to provide high-density non-volatile storage.
- Memory Interface MMC memory interface for host-controller connectivity using the MMC standard.
- Power Wide supply range of 2.7 V to 3.6 V to support common embedded power domains.
- Package 169-TFBGA (14 × 18) package for compact board-level integration.
- Operating Temperature Rated for −40 °C to 85 °C (TA) to support extended temperature applications.
- Memory Format & Technology FLASH NAND non-volatile memory in MMC format, organized for byte-wide access (×8).
Typical Applications
- Embedded storage systems — high-density MMC flash for on-board data and code storage in embedded designs.
- Industrial equipment — non-volatile storage for systems requiring operation across −40 °C to 85 °C.
- Compact devices — space-constrained designs that benefit from the 169-TFBGA package and high memory density.
Unique Advantages
- High-density storage: 256 Gbit capacity (32G × 8) offers substantial non-volatile space for large data or firmware images.
- Standard MMC interface: Simplifies integration with hosts and controllers that support MMC connectivity.
- Wide supply voltage: 2.7 V to 3.6 V operation provides compatibility with common system power rails.
- Extended temperature tolerance: Rated −40 °C to 85 °C to accommodate a wide range of environmental conditions.
- Compact package: 169-TFBGA (14 × 18) reduces board area for space-sensitive applications.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The MTFC32GJUEF-AIT TR combines high-density NAND flash memory with an MMC interface, a compact 169-TFBGA package, and a broad operating voltage and temperature range. These characteristics make it suitable for designs that require substantial non-volatile storage in a space-efficient form factor while operating across typical industrial temperature ranges.
Manufactured by Micron Technology Inc., this memory device is a practical option for engineers and procurement teams specifying MMC-based flash storage where capacity, package size, and operating conditions are key selection criteria.
Request a quote or contact sales to obtain pricing, lead time, and availability for the MTFC32GJUEF-AIT TR.
