MTFC32GJVED-3M WT
| Part Description |
IC FLASH 256GBIT MMC 169VFBGA |
|---|---|
| Quantity | 668 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-VFBGA | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GJVED-3M WT – IC FLASH 256GBIT MMC 169VFBGA
The MTFC32GJVED-3M WT is a non-volatile NAND flash memory device in Micron Technology Inc.'s e•MMC™ series. It provides 256 Gbit of flash storage (organized as 32G × 8) with an MMC memory interface for embedded storage applications.
Key characteristics include a 169‑VFBGA package, a supply voltage range of 2.7 V to 3.6 V, and an operating temperature range of −25 °C to 85 °C, making it suitable for systems that require high-density, packaged flash memory with MMC connectivity.
Key Features
- Memory Technology NAND flash non-volatile memory providing persistent storage.
- Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 for byte-oriented access.
- Interface MMC memory interface for embedded device integration.
- Voltage Supply Supports a supply voltage range of 2.7 V to 3.6 V.
- Package 169‑VFBGA package (supplier device package: 169‑VFBGA) for board-level mounting.
- Operating Temperature Specified operating range of −25 °C to 85 °C (TA).
Typical Applications
- Embedded systems Provides onboard non-volatile storage where an MMC interface and high density flash are required.
- Consumer electronics Integration in devices that use packaged NAND flash with MMC connectivity for media and firmware storage.
- Industrial devices Storage solution for equipment operating within the specified −25 °C to 85 °C temperature range.
Unique Advantages
- High-density storage: 256 Gbit capacity enables consolidation of large data or firmware images into a single device.
- Standard MMC interface: Simplifies integration into systems designed for MMC memory connectivity.
- Wide supply voltage range: 2.7 V to 3.6 V support offers flexibility across multiple power domains.
- Compact VFBGA package: 169‑VFBGA delivers a small board footprint for space-constrained designs.
- Extended operating temperature: Rated for −25 °C to 85 °C to address a range of ambient conditions.
Why Choose MTFC32GJVED-3M WT?
The MTFC32GJVED-3M WT positions itself as a high-density e•MMC flash memory option combining 256 Gbit NAND storage with an MMC interface and a compact 169‑VFBGA package. Its voltage and temperature specifications make it suitable for embedded and industrial designs that require packaged non-volatile storage.
This device is appropriate for engineers and procurement teams seeking a packaged flash memory solution with clear capacity, interface, package, and environmental specifications for long-term integration into product designs.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MTFC32GJVED-3M WT.
