MTFC4GLWDM-4M AAT A

The MTFC4GLWDM-4M AAT A is a 256 Gbit non-volatile NAND flash memory device from Micron Technology Inc.'s e•MMC™ series. It is organized as 32G × 8 and implements FLASH NAND (SLC) technology with an eMMC memory interface.

Supplied in a 153-TFBGA package (153-FBGA, 11.5 × 13 mm) and specified for an operating temperature range of −40°C to 105°C, this device addresses designs requiring a high-density eMMC storage element in a compact BGA footprint.

Key Features

• Memory Format & Capacity 256 Gbit non-volatile FLASH memory organized as 32G × 8, providing high-density on-board storage.
• Technology FLASH - NAND (SLC) technology as specified for the device.
• Interface eMMC memory interface for integrated embedded storage implementations.
• Package 153-TFBGA / 153-FBGA package (11.5 × 13 mm) for space-efficient board-level integration.
• Operating Temperature Range Rated for −40°C to 105°C to support systems requiring extended temperature operation.
• Memory Organization 32G × 8 organization for predictable addressing and capacity layout.

Typical Applications

• Embedded storage systems — Provides 256 Gbit of eMMC NAND storage for devices that require on-board non-volatile memory with an eMMC interface.
• Industrial equipment — Operation from −40°C to 105°C supports deployment in industrial environments with extended temperature requirements.
• Compact consumer electronics — High-density 153-FBGA packaging allows board space savings in compact product designs requiring substantial local storage.
• Networking and edge devices — eMMC interface and SLC NAND technology provide a standardized embedded storage option for networked appliances and edge compute modules.

Unique Advantages

• High-density storage: 256 Gbit capacity delivers substantial on-board non-volatile memory in a single device.
• SLC NAND technology: FLASH - NAND (SLC) construction as specified for the product.
• Standard eMMC interface: Simplifies integration into embedded systems that support eMMC memory.
• Compact BGA footprint: 153-TFBGA / 153-FBGA (11.5 × 13 mm) package minimizes PCB area for high-density designs.
• Extended temperature rating: −40°C to 105°C specification supports applications with wide ambient temperature ranges.
• Clear memory organization: 32G × 8 layout enables straightforward capacity planning and addressing.

Why Choose IC FLASH 256GBIT EMMC 153FBGA?

The MTFC4GLWDM-4M AAT A combines a high 256 Gbit capacity with eMMC interface compatibility and SLC NAND technology in a space-efficient 153-FBGA package. Its 32G × 8 organization and extended operating temperature range of −40°C to 105°C make it suitable for designs that need substantial on-board non-volatile storage with compact footprint and extended-temperature operation.

This device is positioned for customers and designs requiring standardized eMMC storage in a compact package, offering a straightforward integration path where on-board NAND capacity, package size, and thermal range are primary selection criteria.

If you would like pricing or availability information for the MTFC4GLWDM-4M AAT A, request a quote or contact sales to discuss your requirements.