MTFC4GLUDM-AIT

IC FLASH 32GBIT MMC 169TFBGA
Part Description

IC FLASH 32GBIT MMC 169TFBGA

Quantity 624 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-TFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GLUDM-AIT – IC FLASH 32GBIT MMC 169TFBGA

The MTFC4GLUDM-AIT is a Micron e•MMC™ series 32 Gbit non-volatile FLASH memory device organized as 4G × 8 using NAND technology. It implements an MMC memory interface and is supplied in a 169-TFBGA (14×18) package.

This device targets systems that require onboard non-volatile storage with a standard MMC interface, supporting a supply voltage range of 2.7 V to 3.6 V and an operating temperature range of −40 °C to 85 °C.

Key Features

  • Memory Type: Non-volatile FLASH (NAND) memory organized as 4G × 8, providing 32 Gbit of storage capacity.
  • Interface: MMC memory interface for integration into systems that require MMC-compliant storage connectivity.
  • Voltage Supply: Operates from 2.7 V to 3.6 V, enabling compatibility with a range of 3 V system power domains.
  • Operating Temperature: Specified for −40 °C to 85 °C ambient operation (TA), supporting designs requiring this thermal range.
  • Package: Supplied in a 169-TFBGA package (14×18), suitable for compact PCB layouts.
  • Memory Size: 32 Gbit capacity for applications needing multi-gigabit non-volatile storage.

Typical Applications

  • Embedded storage: Onboard non-volatile storage for embedded systems that require an MMC interface and multi-gigabit capacity.
  • Firmware and data retention: Storage of firmware, configuration data, or user data within systems operating between −40 °C and 85 °C.
  • Space-constrained designs: Compact 169-TFBGA (14×18) package for applications where PCB footprint is limited and an MMC memory solution is required.

Unique Advantages

  • Large NAND capacity: 32 Gbit (4G × 8) provides significant non-volatile storage for data and firmware.
  • Standard MMC interface: Simplifies integration into systems designed for MMC connectivity.
  • Wide supply range: 2.7 V to 3.6 V operation supports compatibility with common 3 V power rails.
  • Extended operating temperature: Rated for −40 °C to 85 °C, suitable for applications within this ambient range.
  • Compact BGA package: 169-TFBGA (14×18) enables dense board-level integration and small form factors.

Why Choose IC FLASH 32GBIT MMC 169TFBGA?

IC FLASH 32GBIT MMC 169TFBGA (MTFC4GLUDM-AIT) delivers a straightforward, high-capacity NAND flash option in the Micron e•MMC™ family, combining 32 Gbit of storage with an MMC interface and compact 169-TFBGA packaging. Its electrical and thermal specifications—2.7 V to 3.6 V supply and −40 °C to 85 °C operating range—make it appropriate for designs that require robust non-volatile storage within those limits.

This device is suited to engineers and procurement teams looking for a multi-gigabit MMC-based flash component for embedded storage, firmware retention, or space-constrained implementations where the specified package, voltage range, and temperature rating match system requirements.

Request a quote or contact sales to discuss availability, pricing, and lead times for MTFC4GLUDM-AIT.

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