MTFC4GLUDM-AIT TR

IC FLASH 32GBIT MMC 169TFBGA
Part Description

IC FLASH 32GBIT MMC 169TFBGA

Quantity 863 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-TFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging169-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GLUDM-AIT TR – IC FLASH 32GBIT MMC 169TFBGA

The MTFC4GLUDM-AIT TR is a 32 Gbit non-volatile FLASH memory device using NAND technology with an MMC memory interface. It is organized as 4G × 8 and is supplied in a 169-TFBGA (14×18) package.

With an operating voltage range of 2.7 V to 3.6 V and an ambient temperature rating of -40°C to 85°C, this device is intended for applications that require onboard NAND flash storage in a compact BGA package.

Key Features

  • Memory Type & Technology  Non-volatile FLASH using NAND technology, organized as 4G × 8 to provide 32 Gbit of storage.
  • Memory Interface  MMC interface for system memory connectivity consistent with MMC memory formats.
  • Voltage Supply  Operates from 2.7 V to 3.6 V, matching common system power rails.
  • Operating Temperature  Rated for -40°C to 85°C (TA) to support a broad ambient temperature range.
  • Package  169-TFBGA (14×18) supplier device package for compact board-level integration.
  • Memory Format & Organization  FLASH memory format with a 4G × 8 organization to meet capacity and addressing requirements.

Typical Applications

  • Embedded storage systems  Onboard non-volatile storage where 32 Gbit NAND FLASH with an MMC interface is required for code or data.
  • Compact electronic designs  Integration into space-constrained boards using the 169-TFBGA (14×18) package.
  • Firmware and data retention  Storage of firmware images and retained data within the specified voltage and temperature ranges.

Unique Advantages

  • Large 32 Gbit capacity: Consolidates significant non-volatile storage into a single device.
  • MMC interface: Enables integration with systems designed for MMC memory connectivity.
  • Wide supply voltage range: 2.7 V to 3.6 V operation supports common system power domains.
  • Extended temperature rating: -40°C to 85°C specification supports deployment across varied ambient conditions.
  • Compact TFBGA package: 169-TFBGA (14×18) footprint assists in minimizing board area.

Why Choose IC FLASH 32GBIT MMC 169TFBGA?

The MTFC4GLUDM-AIT TR provides a straightforward, verifiable specification set: 32 Gbit NAND FLASH capacity, MMC interface, a 169-TFBGA (14×18) package, 2.7 V–3.6 V supply range, and an operating temperature range of -40°C to 85°C. These characteristics make it suitable for designs that require compact, MMC-compatible non-volatile storage with defined electrical and thermal limits.

Manufactured by Micron Technology Inc., this device is positioned for engineers and procurement teams seeking a known-capacity FLASH component in a compact package for embedded systems, firmware storage, and other applications that match the listed specifications.

Request a quote or contact sales to discuss availability, pricing, and ordering for the MTFC4GLUDM-AIT TR.

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