MTFC4GMDEA-R1 IT

IC FLASH 32GBIT MMC 153WFBGA
Part Description

IC FLASH 32GBIT MMC 153WFBGA

Quantity 838 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MTFC4GMDEA-R1 IT – IC FLASH 32 Gbit MMC, 153-WFBGA

The MTFC4GMDEA-R1 IT is a 32 Gbit non-volatile NAND flash device in Micron Technology Inc.'s e•MMC™ series. It implements a 4G × 8 memory organization and provides onboard FLASH storage with an MMC interface.

Designed for systems requiring MMC-based non-volatile memory, the device operates from 2.7 V to 3.6 V and across a temperature range of -40°C to 85°C. It is supplied in a 153-WFBGA package (11.5 × 13 mm).

Key Features

  • Memory Technology  NAND flash non-volatile memory in FLASH format with a total capacity of 32 Gbit.
  • Memory Organization  4G × 8 organization for the device capacity.
  • Interface  MMC memory interface consistent with the e•MMC™ series.
  • Voltage Supply  Supports a supply voltage range of 2.7 V to 3.6 V.
  • Package  153-WFBGA package, dimensions 11.5 × 13 mm.
  • Operating Temperature  Rated for ambient operation from -40°C to 85°C (TA).
  • Manufacturer and Series  Micron Technology Inc., e•MMC™ series.

Typical Applications

  • MMC-based storage  Onboard non-volatile storage using the MMC interface for systems requiring integrated FLASH memory.
  • Firmware and system storage  Storage of firmware and system images where 32 Gbit of NAND FLASH is required.
  • Temperature‑sensitive deployments  Applications that require operation across -40°C to 85°C.
  • Space-constrained boards  High-density FLASH in a 153-WFBGA (11.5 × 13 mm) package for compact PCB layouts.

Unique Advantages

  • High-density capacity:  32 Gbit of NAND FLASH provides substantial onboard non-volatile storage in a single device.
  • Standard MMC interface:  MMC interface simplifies integration where MMC connections are required.
  • Wide supply voltage range:  Operates from 2.7 V to 3.6 V to match common system power rails.
  • Extended temperature range:  Rated for -40°C to 85°C to support a broad range of ambient conditions.
  • Compact package:  153-WFBGA (11.5 × 13 mm) package offers a small footprint for dense board designs.

Why Choose IC FLASH 32GBIT MMC 153WFBGA?

The MTFC4GMDEA-R1 IT positions itself as a straightforward e•MMC™ NAND flash memory option that combines 32 Gbit capacity, MMC connectivity, and a compact 153-WFBGA package. Its supplied voltage range and ambient temperature rating make it suitable for designs that require reliable onboard FLASH storage within the specified electrical and thermal limits.

This device is appropriate for designers and engineers seeking an integrated MMC-based flash memory component with defined capacity, package, supply voltage, and operating temperature characteristics.

Request a quote or submit an inquiry for pricing and availability to receive further purchasing information and lead-time details.

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