MTFC4GMVEA-IT TR

IC FLASH 32GBIT MMC 153WFBGA
Part Description

IC FLASH 32GBIT MMC 153WFBGA

Quantity 97 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GMVEA-IT TR – IC FLASH 32GBIT MMC 153WFBGA

The MTFC4GMVEA-IT TR is a 32 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It implements a 4G × 8 memory organization and exposes an MMC interface for board-level embedded storage.

Packaged in a 153-WFBGA (11.5 × 13 mm) footprint and supporting a 2.7 V to 3.6 V supply range and an operating temperature of -40 °C to 85 °C, this device is intended for systems that require MMC-compatible NAND flash storage with a compact ball-grid package.

Key Features

  • Memory Type  Non-volatile NAND flash memory providing 32 Gbit of storage capacity.
  • Memory Organization  4G × 8 organization for straightforward byte-oriented storage addressing.
  • Interface  MMC memory interface for embedded storage integration using standard MMC signaling.
  • Voltage Supply  Operates from 2.7 V to 3.6 V to match common single-supply system rails.
  • Package  153-WFBGA package (11.5 × 13 mm) suitable for compact board-level mounting.
  • Temperature Range  Rated for operation from -40 °C to 85 °C (TA) for extended-temperature applications.

Typical Applications

  • Embedded storage systems  MMC interface and 32 Gbit NAND capacity make the device suitable for board-level embedded storage implementations.
  • Compact module integration  153-WFBGA package supports designs where a small BGA footprint is required for space-constrained PCBs.
  • Systems requiring extended temperature operation  The -40 °C to 85 °C operating range supports deployments in environments with wide ambient temperature swings.

Unique Advantages

  • High-density storage:  32 Gbit capacity in a single component reduces the need for multiple devices to reach target storage sizes.
  • Standard MMC interface:  MMC compatibility simplifies integration into systems designed for MMC-based flash storage.
  • Compact BGA package:  153-WFBGA (11.5 × 13 mm) enables compact board layouts while providing a robust ball-grid mounting solution.
  • Wide supply voltage range:  2.7 V to 3.6 V support allows flexibility with common system power rails.
  • Extended operating temperature:  -40 °C to 85 °C rating supports broader deployment environments compared to room-temperature-only devices.

Why Choose IC FLASH 32GBIT MMC 153WFBGA?

The MTFC4GMVEA-IT TR combines a 32 Gbit NAND flash array with an MMC interface and a compact 153-WFBGA package, delivering a straightforward embedded storage option for designs that require a balance of capacity, form factor, and environmental range. Its electrical and thermal specifications align with systems using standard 2.7 V–3.6 V supplies and needing operation from -40 °C to 85 °C.

This product is suited to engineers and procurement teams looking for a single-device storage solution that integrates into MMC-compatible designs, supports a compact PCB footprint, and meets extended-temperature requirements for reliable field operation.

If you would like pricing, lead-time, or to request a quote for MTFC4GMVEA-IT TR, please submit a request or contact our sales team to receive more information and assistance.

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