MTFC4GMWDM-3M AIT
| Part Description |
IC FLASH 32GBIT MMC 153TFBGA |
|---|---|
| Quantity | 354 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC4GMWDM-3M AIT – IC FLASH 32GBIT MMC 153TFBGA
The MTFC4GMWDM-3M AIT is a 32 Gbit non-volatile NAND flash memory device in the e•MMC™ series, provided in a 153-TFBGA package. It implements a FLASH - NAND architecture with an MMC memory interface for integrated on-board storage.
Designed for systems that require embedded MMC storage, the device combines 32 Gbit capacity, a 4G × 8 memory organization, and a compact 153-TFBGA (11.5×13 mm) package with a 2.7 V to 3.6 V supply range and an operating temperature of -40°C to 85°C.
Key Features
- Memory Type & Technology Non-volatile storage implemented as FLASH - NAND, providing persistent data retention.
- Capacity 32 Gbit total memory size suitable for embedded storage needs.
- Memory Organization 4G × 8 organization, as specified for internal memory arrangement.
- Interface MMC memory interface for integration with MMC host controllers and systems expecting an MMC form factor.
- Voltage Supply Operates from 2.7 V to 3.6 V, matching common system power rails.
- Package 153-TFBGA package with supplier device package dimensions of 11.5×13 mm for space-constrained assemblies.
- Operating Temperature Rated for -40°C to 85°C (TA) to support a wide ambient temperature range.
Unique Advantages
- High-density embedded storage: 32 Gbit capacity provides substantial on-board FLASH for applications needing significant non-volatile memory.
- Standard MMC interface: The MMC interface simplifies integration into systems that use MMC host controllers or require MMC-formatted storage.
- Wide supply voltage range: 2.7 V to 3.6 V operation enables compatibility with common 3.0 V system rails.
- Compact BGA package: 153-TFBGA (11.5×13 mm) offers a small footprint for space-limited PCB designs.
- Extended operating temperature: -40°C to 85°C rating supports deployment across a broad set of environmental conditions.
Why Choose IC FLASH 32GBIT MMC 153TFBGA?
The MTFC4GMWDM-3M AIT positions itself as an embedded MMC NAND flash device offering a balance of capacity, compact packaging, and wide operating conditions. Its 32 Gbit FLASH - NAND architecture, MMC interface, and 153-TFBGA package make it suitable for designs requiring integrated non-volatile storage with a defined supply and temperature envelope.
This part is appropriate for engineers and procurement teams specifying MMC-based embedded storage where a 2.7 V–3.6 V supply, -40°C to 85°C operation, and a 153-TFBGA footprint are required. The straightforward specification set supports predictable integration and supply-chain considerations for long-term deployment.
Request a quote or contact sales to discuss pricing, availability, and lead times for the MTFC4GMWDM-3M AIT.
