MTFC4GMWDM-3M AIT A TR
| Part Description |
IC FLASH 32GBIT MMC 153TFBGA |
|---|---|
| Quantity | 856 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 8542.32.0071 |
Overview of MTFC4GMWDM-3M AIT A TR – IC FLASH 32 Gbit e•MMC in 153‑TFBGA
The MTFC4GMWDM-3M AIT A TR is a 32 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It is organized as 4G × 8 and provides an MMC memory interface for integration into systems requiring embedded flash storage.
Key device attributes include FLASH‑NAND technology, a supply voltage range of 2.7 V to 3.6 V, and a 153‑TFBGA package (11.5x13). The device supports an ambient operating temperature range of -40°C to 85°C.
Key Features
- Core / Technology NAND FLASH technology implemented as non-volatile memory for persistent data storage.
- Memory Organization & Capacity 4G × 8 organization delivering 32 Gbit total memory capacity.
- Memory Interface MMC interface compatible with e•MMC series implementations for embedded memory connectivity.
- Power Wide voltage supply range of 2.7 V to 3.6 V to accommodate typical embedded system power rails.
- Package Supplied in a 153‑TFBGA package (11.5x13), suitable for board‑level mounting with the specified supplier device package.
- Temperature Range Rated for operation from -40°C to 85°C (TA) for deployment across a broad ambient range.
Typical Applications
- MMC-based storage Use where an MMC interface with 32 Gbit NAND flash capacity is required for embedded storage functions.
- Board-level non-volatile memory Integration on system PCBs that require FLASH‑NAND memory in a 153‑TFBGA footprint.
- Temperature-sensitive deployments Systems that must operate across -40°C to 85°C can leverage the device’s specified operating range.
Unique Advantages
- Substantial onboard capacity: 32 Gbit memory provides significant storage within a single e•MMC device for embedded applications.
- Standard MMC interface: MMC interface simplifies integration into systems designed for e•MMC memory connectivity.
- Flexible power range: 2.7 V to 3.6 V supply range allows compatibility with common system power rails.
- Compact package: 153‑TFBGA (11.5x13) package enables high-density board mounting while maintaining device footprint consistency.
- Extended ambient operation: Rated -40°C to 85°C for operation across a wide range of environmental conditions.
Why Choose IC FLASH 32GBIT MMC 153TFBGA?
The MTFC4GMWDM-3M AIT A TR positions itself as a 32 Gbit e•MMC NAND flash component offering a standard MMC interface, wide supply voltage range, and a compact 153‑TFBGA package. Its organization and FLASH‑NAND technology provide a clearly defined on-board memory option for designs that require embedded MMC storage within the specified environmental and electrical limits.
This device is suited to designs and customers seeking a straightforward, board-mounted e•MMC memory solution with defined capacity, package, interface, voltage, and operating temperature specifications.
To request a quote or submit an inquiry for availability and pricing, please contact sales with the part number MTFC4GMWDM-3M AIT A TR and your quantity and delivery requirements.
