MTFC4GMWDM-3M AIT TR

The MTFC4GMWDM-3M AIT TR is a 32 Gbit non-volatile FLASH memory device from Micron Technology Inc., organized as 4G × 8 and implemented with NAND FLASH technology. It provides embedded storage via an MMC memory interface in a compact 153-TFBGA package.

Designed for systems that require onboard, non-volatile storage, this e•MMC series device delivers a standard MMC interface, a 2.7 V to 3.6 V supply range, and an extended operating temperature range of −40°C to 85°C for broad environmental use.

Key Features

• Memory Technology  NAND FLASH non-volatile memory providing persistent data storage without continuous power.
• Capacity & Organization  32 Gbit capacity organized as 4G × 8 to support moderate-density embedded storage requirements.
• Interface  MMC memory interface for standardized connectivity in systems that support MMC protocols.
• Voltage Supply  Operates from 2.7 V to 3.6 V, covering common single-cell lithium and 3.3 V system rails.
• Package  153‑TFBGA package with supplier device package dimension 11.5 × 13 mm for compact board-level integration.
• Operating Temperature  Specified for −40°C to 85°C (TA), suitable for applications requiring extended temperature tolerance.

Typical Applications

• Embedded storage  Onboard non-volatile storage for systems that require MMC-based memory integration and firmware/data retention.
• Handheld and portable devices  Compact 153‑TFBGA package and 2.7 V–3.6 V operation make the device suitable for space-constrained, battery-powered designs.
• Industrial equipment  Operation across −40°C to 85°C supports deployment in industrial controllers and instrumentation that require reliable non-volatile storage.

Unique Advantages

• Standard MMC interface: Simplifies system integration where MMC connectivity is required, enabling straightforward interfacing with MMC host controllers.
• 32 Gbit NAND capacity: Provides moderate-density onboard storage for firmware, file systems, and application data without external memory arrangements.
• Wide voltage range: 2.7 V to 3.6 V compatibility supports common system power rails, reducing power-supply constraints during design.
• Compact BGA package: 153‑TFBGA (11.5 × 13 mm) minimizes PCB area for compact system layouts while providing ball-grid mounting for automated assembly.
• Extended temperature tolerance: −40°C to 85°C rating supports deployment in temperature-challenging environments.

Why Choose IC FLASH 32GBIT MMC 153TFBGA?

The MTFC4GMWDM-3M AIT TR combines Micron's NAND FLASH technology with an MMC interface and a compact 153‑TFBGA package to deliver a straightforward, board-mountable non-volatile storage solution. Its 32 Gbit capacity, standard interface, and support for a 2.7 V–3.6 V supply make it suitable for designs that require reliable embedded storage and easy system integration.

This device is well suited for engineers designing systems that need verified non-volatile memory capacity, compact packaging, and an extended operating temperature window. It offers a clear specification set for procurement and design decisions where MMC-based flash storage is required.

Request a quote or contact sales to discuss pricing, availability, and volume options for the MTFC4GMWDM-3M AIT TR.