MTFC8GACAENS-AIT TR

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 200 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNOBSOLETEHTS Code0000.00.0000

Overview of MTFC8GACAENS-AIT TR – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GACAENS-AIT TR is a non-volatile NAND flash memory device in the e•MMC™ series providing 64 Gbit of storage in an 8G × 8 organization. It implements an MMC memory interface and is supplied in a 153-TFBGA package (11.5 × 13 mm), offering a compact footprint for embedded storage applications.

Designed to operate from a 2.7 V to 3.6 V supply and across an ambient temperature range of −40 °C to 85 °C, this device targets systems that require solid-state flash storage with a standard MMC interface and a small BGA package.

Key Features

  • Memory Type & Technology Non-volatile FLASH memory using NAND technology for persistent data storage.
  • Capacity & Organization 64 Gbit total capacity, organized as 8G × 8 for byte-oriented memory access.
  • Interface MMC memory interface for standard embedded MMC connectivity.
  • Supply Voltage Operates from 2.7 V to 3.6 V, supporting common embedded system power rails.
  • Package 153-TFBGA package with supplier device package dimension 11.5 × 13 mm, enabling compact board-level integration.
  • Operating Temperature Specified ambient operating range of −40 °C to 85 °C (TA).
  • Grade Grade listed as Automotive in product data.

Unique Advantages

  • High-density storage: 64 Gbit capacity provides substantial non-volatile storage in a single device, reducing the need for multiple components.
  • Standard MMC interface: Facilitates integration into systems that use MMC for onboard flash storage without requiring custom interface logic.
  • Compact BGA package: The 153-TFBGA (11.5 × 13 mm) package saves board area and supports high-density system designs.
  • <strong-Wide supply range: Compatibility with 2.7 V to 3.6 V systems simplifies power-supply design across different platforms.
  • Wide ambient temperature: Operation from −40 °C to 85 °C supports deployment in a broad range of environmental conditions.
  • e•MMC™ series integration: Part of the e•MMC™ series for consistent product family selection and form-factor expectations.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GACAENS-AIT TR combines a high-density 64 Gbit NAND flash organization with a standard MMC interface and a compact 153-TFBGA package, making it suitable for embedded designs that need substantial onboard non-volatile storage within a small footprint. Its 2.7 V to 3.6 V supply range and −40 °C to 85 °C ambient rating align with many embedded system power and thermal requirements.

This device is appropriate for engineers and procurement teams specifying e•MMC™ family flash in applications where a balance of capacity, package size, and standard MMC connectivity is required. The documented specifications support straightforward evaluation for system integration and BOM consolidation.

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