MTFC8GLWDQ-3M AIT A
| Part Description |
IC FLASH 64GBIT MMC 100LBGA |
|---|---|
| Quantity | 41 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLWDQ-3M AIT A – IC FLASH 64GBIT MMC 100LBGA
The MTFC8GLWDQ-3M AIT A is a 64 Gbit non-volatile flash memory device in Micron's e•MMC™ series. It implements NAND flash technology with an MMC memory interface and an 8G × 8 memory organization.
Its defining characteristics include a 64 Gbit capacity, MMC interface, 100‑lead BGA (14 × 18 mm) package, a 2.7 V to 3.6 V supply range, and an operating temperature range of −40 °C to 85 °C, providing a compact packaged storage option for designs that require solid-state flash memory.
Key Features
- Memory Type & Technology Non-volatile NAND flash memory formatted as FLASH; memory type is explicitly listed as Non-Volatile and Technology as FLASH - NAND.
- Capacity & Organization 64 Gbit total capacity with an 8G × 8 memory organization, suitable where defined flash density and organization are required.
- Interface MMC memory interface provided for host communication and integration with MMC-compatible controllers.
- Voltage Supply Operates from 2.7 V to 3.6 V, matching common system supply rails for flash memory devices.
- Package 100‑lead LBGA in a 14 × 18 mm supplier device package, delivering a compact board footprint in a ball grid array format.
- Operating Temperature Specified operating ambient range of −40 °C to 85 °C (TA), suitable for electronics requiring that thermal range.
- Series Part of the e•MMC™ series, indicating its memory architecture and family designation.
- Grade Grade indicated as Automotive in the product data.
Unique Advantages
- High-density storage: 64 Gbit capacity provides substantial on-board non-volatile storage in a single device.
- Standard MMC interface: MMC interface eases integration with systems designed for MMC-based flash memory.
- Compact BGA package: 100‑lead LBGA (14 × 18 mm) minimizes PCB area while providing a board-mounted flash solution.
- Wide operating voltage: 2.7 V to 3.6 V supply range supports common system power rails.
- Extended temperature range: −40 °C to 85 °C ambient operating range supports deployment in environments requiring that specification.
- NAND flash technology: FLASH - NAND provides non-volatile memory retention as specified in the product data.
Why Choose MTFC8GLWDQ-3M AIT A?
The MTFC8GLWDQ-3M AIT A is positioned as a high-capacity e•MMC™ flash memory device with clear, verifiable specifications for capacity, interface, package, voltage, and temperature. It is appropriate for designs that require a defined 64 Gbit NAND flash with an MMC interface and a 100‑lead LBGA package footprint.
Specified electrical and thermal ranges, together with the listed package and memory organization, make this device a straightforward selection for engineers and procurement teams seeking a documented flash memory part for systems aligned with these exact specifications.
Please request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the MTFC8GLWDQ-3M AIT A.
