MTFC8GLWDQ-3M AIT A TR

IC FLASH 64GBIT MMC 100LBGA
Part Description

IC FLASH 64GBIT MMC 100LBGA

Quantity 22 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-LBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MTFC8GLWDQ-3M AIT A TR – IC FLASH 64GBIT MMC 100LBGA

The MTFC8GLWDQ-3M AIT A TR is a 64 Gbit non-volatile NAND FLASH memory device with an MMC interface, supplied by Micron Technology Inc. It is organized as 8G × 8 and provided in a 100‑LBGA (14×18) package.

Designed for board‑level integration where high-density MMC flash is required, the device operates from a 2.7 V to 3.6 V supply and supports an interface clock frequency of 52 MHz, with an operating temperature range of −40 °C to 85 °C.

Key Features

  • Memory Type NAND flash non-volatile memory implemented as FLASH, 64 Gbit capacity organized as 8G × 8.
  • Interface MMC memory interface with a listed clock frequency of 52 MHz for host communication.
  • Power Operates from a 2.7 V to 3.6 V supply range.
  • Package 100‑lead LBGA package (14 × 18 mm) suitable for compact, board‑level mounting.
  • Operating Range Specified operating ambient temperature from −40 °C to 85 °C (TA).
  • Manufacturer and Series Micron Technology Inc., e•MMC™ series; memory format listed as FLASH.

Typical Applications

  • Embedded storage systems Use as MMC flash memory where 64 Gbit of non-volatile data or code storage is required.
  • Firmware and data retention Storage of firmware or persistent data in systems operating within −40 °C to 85 °C.
  • Compact board designs High-density flash in a 100‑LBGA (14×18) package for space-constrained PCB layouts.

Unique Advantages

  • High storage density: 64 Gbit capacity enables substantial data or firmware storage in a single device.
  • Standard MMC interface: MMC interface and 52 MHz clocking simplify integration with MMC host controllers.
  • Wide supply range: 2.7 V to 3.6 V operation supports typical 3.3 V system architectures.
  • Extended temperature capability: −40 °C to 85 °C operating range addresses applications with broad ambient conditions.
  • Compact package: 100‑LBGA (14×18) package balances board space and thermal/mechanical characteristics for surface-mount designs.

Why Choose MTFC8GLWDQ-3M AIT A TR?

The MTFC8GLWDQ-3M AIT A TR delivers a clear combination of high-density NAND flash, MMC interface compatibility, and practical electrical and thermal operating ranges. Its 64 Gbit capacity and 8G × 8 organization are suitable for systems that require significant non-volatile storage in a compact 100‑LBGA footprint.

As a Micron e•MMC™ series device, it is appropriate for designers seeking a board-level MMC flash component with defined supply and temperature specifications. The device's listed attributes support straightforward evaluation for designs requiring 2.7 V–3.6 V operation and up to 52 MHz MMC host clocking.

Request a quote or submit an inquiry for MTFC8GLWDQ-3M AIT A TR to obtain pricing, availability, and lead-time information tailored to your project requirements.

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