MTFC8GLXEA-WT

IC FLASH 64GBIT MMC 153WFBGA
Part Description

IC FLASH 64GBIT MMC 153WFBGA

Quantity 1,220 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLXEA-WT – IC FLASH 64GBIT MMC 153WFBGA

The MTFC8GLXEA-WT is a Micron e•MMC series non-volatile NAND flash memory device offering 64 Gbit of onboard storage. It implements a FLASH (NAND) memory architecture with an MMC memory interface and an 8G × 8 organization.

Designed for embedded storage applications, this device combines high density, a compact 153-WFBGA package (11.5×13 mm), a 2.7 V–3.6 V supply range, and an operating temperature range of −25°C to 85°C to meet space- and power-constrained system requirements.

Key Features

  • Core / Memory: NAND flash memory with 64 Gbit capacity and 8G × 8 organization for high-density non-volatile storage.
  • Memory Format: FLASH — non-volatile storage suitable for persistent firmware and data retention.
  • Interface: MMC memory interface consistent with the e•MMC series for embedded system integration.
  • Power: Voltage supply range of 2.7 V to 3.6 V to match typical system power rails.
  • Package: 153-WFBGA (11.5×13 mm) supplier device package for compact board-level footprint.
  • Operating Temperature: −25°C to 85°C (TA) for deployment across a range of ambient conditions.

Typical Applications

  • Embedded storage for consumer devices: Provides non-volatile capacity for firmware, system images and user data in compact product designs.
  • Industrial and commercial equipment: Compact package and extended temperature range support space-constrained systems operating across varied environments.
  • System firmware and OS storage: High-density NAND flash suits use as onboard persistent storage for operating systems and application firmware.

Unique Advantages

  • High-density capacity: 64 Gbit of storage reduces the need for multiple external memory components.
  • Compact WFBGA footprint: 153-WFBGA (11.5×13 mm) minimizes PCB area for space-limited designs.
  • Standard MMC interface: e•MMC series interface simplifies integration with compatible host controllers.
  • Flexible power compatibility: 2.7 V–3.6 V supply range aligns with common system power domains.
  • Broader ambient operation: −25°C to 85°C operating range supports deployment in a variety of environments.

Why Choose IC FLASH 64GBIT MMC 153WFBGA?

The MTFC8GLXEA-WT positions itself as a compact, high-density e•MMC NAND flash option for designs that require reliable non-volatile storage within a limited board area and standard MMC interface. Its combination of 64 Gbit capacity, compact 153-WFBGA package, and broad supply and temperature ranges makes it suited for embedded systems needing persistent firmware and data storage.

This device is appropriate for engineers and procurement teams specifying onboard flash memory for compact consumer, industrial, or commercial products where straightforward integration and a defined operating envelope are primary considerations.

Request a quote or contact sales to discuss availability, pricing, and how the MTFC8GLXEA-WT can meet your embedded storage requirements.

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