MTFC8GLZDM-1M WT

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 355 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLZDM-1M WT – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GLZDM-1M WT is a 64 Gbit non-volatile flash memory device from Micron Technology Inc., implemented as NAND FLASH with an MMC interface. It combines high-density storage in a 153-TFBGA package and supports a 2.7 V to 3.6 V supply range with an operating temperature range of -25°C to 85°C.

This device is intended for systems that require a compact, high-capacity flash memory module with an MMC interface and Ethernet-class packaging dimensions (153-TFBGA, 11.5 × 13 mm).

Key Features

  • Memory Type and Technology Non-volatile FLASH memory using NAND technology for persistent data storage.
  • Capacity and Organization 64 Gbit total capacity with an organization of 8G × 8, providing large on-board storage in a single device.
  • Interface MMC memory interface for integration into MMC-capable host controllers and systems.
  • Voltage Supply Operates from 2.7 V to 3.6 V, enabling use with common 3 V system rails.
  • Operating Temperature Rated for operation from -25°C to 85°C (TA), suitable for a range of temperature environments.
  • Package 153-TFBGA package (11.5 × 13 mm) providing a compact solderable form factor for surface-mount assembly.
  • Manufacturer and Series Micron Technology Inc., e•MMC™ series identifier.

Typical Applications

  • Embedded Storage Use as high-density non-volatile storage in embedded systems that support an MMC interface.
  • Firmware and System Code Local storage for firmware, boot code, or system images where 64 Gbit capacity is required.
  • Data Retention in Compact Devices On-board flash memory for compact devices that need persistent data storage within the supplied voltage and temperature ranges.

Unique Advantages

  • High-density capacity: 64 Gbit in a single device allows consolidation of storage requirements without multiple components.
  • Standard MMC interface: Simplifies integration into systems that accept MMC memory, reducing interface design complexity.
  • Compact BGA package: 153-TFBGA (11.5 × 13 mm) offers a small footprint for space-constrained PCBs.
  • Wide supply range: 2.7 V to 3.6 V operation supports compatibility with common 3 V system power rails.
  • Extended operating temperature: Rated from -25°C to 85°C to support a variety of environmental conditions.
  • Clear memory organization: 8G × 8 organization provides predictable addressing and capacity planning for system designers.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GLZDM-1M WT delivers a straightforward, high-capacity NAND flash solution in a compact 153-TFBGA package with an MMC interface and a broad supply voltage range. Its combination of 64 Gbit capacity and 8G × 8 organization makes it suitable for designs that require significant persistent storage while maintaining a small PCB footprint.

This device is appropriate for engineers and procurement teams specifying non-volatile flash memory for embedded systems, firmware storage, or compact devices operating within the provided temperature and voltage windows. Its clear, verifiable specifications support reliable integration into designs where MMC-based flash is required.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the MTFC8GLZDM-1M WT.

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