MTFC8GLXEA-WT TR

IC FLASH 64GBIT MMC 153WFBGA
Part Description

IC FLASH 64GBIT MMC 153WFBGA

Quantity 927 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLXEA-WT TR – 64 Gbit e•MMC™ Flash, 153-WFBGA

The MTFC8GLXEA-WT TR is a Micron e•MMC™ series NAND flash memory device providing 64 Gbit of non-volatile storage in a 153-WFBGA package. It implements a NAND flash architecture organized as 8G × 8 with an MMC memory interface for direct integration into systems that use MMC storage.

Designed for applications that require on-board flash storage, this device combines a defined operating temperature range and a multi-voltage supply window to support a range of embedded system environments.

Key Features

  • Memory Type  Non-volatile NAND flash memory suitable for persistent data storage.
  • Capacity & Organization  64 Gbit total capacity organized as 8G × 8.
  • Interface  MMC memory interface for standard MMC-based host connectivity.
  • Package  153-WFBGA package, supplier device package size 11.5 × 13 mm.
  • Voltage Supply  Operates over a 2.7 V to 3.6 V supply range.
  • Operating Temperature  Specified for −25°C to 85°C (TA) operation.
  • Memory Format  FLASH (NAND) memory format.

Typical Applications

  • Embedded storage systems  Provides on-board flash capacity for designs that require MMC-based memory.
  • Compact device integration  64 Gbit capacity in a 153-WFBGA (11.5 × 13 mm) package for board-level storage integration.
  • Industrial and temperature-sensitive equipment  Use where operation across −25°C to 85°C is required.

Unique Advantages

  • Large, fixed capacity: 64 Gbit of NAND flash in a single device simplifies BOM for medium-density storage needs.
  • Standard MMC interface: Direct MMC connectivity streamlines host integration for MMC-compatible systems.
  • Wide supply range: 2.7 V to 3.6 V operation enables flexibility across different system power rails.
  • Compact BGA package: 153-WFBGA (11.5 × 13 mm) offers a defined footprint for space-aware PCB layouts.
  • Defined thermal window: Rated for −25°C to 85°C to match many embedded operating environments.
  • Clear memory organization: 8G × 8 configuration provides a straightforward capacity and bus-width description for system design.

Why Choose IC FLASH 64GBIT MMC 153WFBGA?

The IC FLASH 64GBIT MMC 153WFBGA delivers a 64 Gbit NAND flash option with an MMC interface and a clear set of electrical and mechanical specifications from Micron Technology Inc. It is suitable for designs that require a known-capacity, MMC-connected non-volatile memory solution with defined operating voltage and temperature ranges.

This device is well suited to engineers and procurement teams specifying MMC-based storage where package size, supply range (2.7–3.6 V) and operating temperature (−25°C to 85°C) are key selection criteria, backed by Micron Technology Inc.'s product offering.

If you would like pricing, lead-time information, or to request a quote for MTFC8GLXEA-WT TR, contact sales to discuss availability and procurement options.

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