AM1707BZKBA3

The AM1707BZKBA3 is a Sitara™ ARM926EJ-S microprocessor in a 256-ball BGA (17×17) package, delivering a single 32-bit core running at 375 MHz for embedded and industrial applications. It integrates a broad subsystem of memory interfaces, high-speed I/O and real-time peripherals to support networking, human‑machine interfaces, and real‑time control tasks.

Designed for industrial-grade deployments, the device operates across a −40 °C to 105 °C temperature range and combines connectivity (Ethernet, USB), display and storage interfaces, and on-chip debug to simplify system design and accelerate development.

Key Features

• Core  ARM926EJ‑S single 32‑bit core running at 375 MHz, supporting 32‑bit and 16‑bit (Thumb®) instruction sets and embedded ICE‑RT for real‑time debug.
• Memory and Storage  Multiple external memory interfaces including 16‑bit SDRAM (up to 256‑MB address space), EMIFA/EMIFB, NOR and NAND support, plus 128 KB of on‑chip RAM and 64 KB ROM.
• Connectivity & I/O  Integrated 10/100 Mbps Ethernet MAC (RMII), USB 2.0 OTG with integrated PHY and USB 1.1 OHCI host with PHY, MMC/SD/SDIO support, and I2C interface for peripheral control.
• Multimedia & Audio  LCD controller for display applications and three multichannel audio serial ports (McASPs) with TDM/I2S support and DIT capability on McASP2.
• Real‑Time & Offload  Programmable Real‑Time Unit Subsystem (PRUSS) with two PRU cores (4 KB instruction RAM/512 B data RAM per core) for deterministic offload tasks and low‑latency control.
• Timers & UARTs  Three configurable 16550‑type UARTs (UART0 with modem control), a 64‑bit general‑purpose timer and a watchdog timer for system timing and safety functions.
• DMA & Performance  Enhanced DMA controller (EDMA3) with 32 independent channels and programmable transfer features to reduce CPU load for high‑bandwidth transfers.
• Package & Temperature  256‑ball BGA (17×17) surface‑mount package rated for industrial operation from −40 °C to 105 °C.

Typical Applications

• Industrial Control & Automation  Use the AM1707BZKBA3 for networked controllers and machine interfaces where deterministic I/O, Ethernet connectivity and industrial temperature range are required.
• Human‑Machine Interfaces (HMI)  Drive LCD panels and manage local I/O, multimedia audio streams and storage (MMC/SD) for operator displays and panel controllers.
• Embedded Networking Devices  Implement 10/100 Ethernet and USB 2.0 OTG connectivity for routers, gateways or field devices needing robust peripheral support and DMA offload.
• Real‑Time Offload & Motor Control  Leverage the PRUSS for deterministic control loops, precise timing and dedicated low‑latency task execution separate from the main CPU.

Unique Advantages

• Integrated connectivity  On‑chip 10/100 Ethernet MAC and USB 2.0 OTG with PHY reduce external component count and simplify board design.
• Comprehensive memory interfaces  Dual external memory interfaces (EMIFA/EMIFB), SDRAM support and NOR/NAND compatibility enable flexible memory architectures for varied application storage needs.
• Deterministic real‑time capability  Programmable Real‑Time Unit Subsystem (PRUSS) offloads time‑critical tasks, improving responsiveness without burdening the main CPU.
• Industrial reliability  Rated for −40 °C to 105 °C operation and supplied in a 256‑ball BGA for robust surface‑mount deployment in industrial environments.
• High‑bandwidth data movement  Enhanced DMA (EDMA3) with multiple channels enables efficient data transfers for multimedia, networking and peripheral streaming.

Why Choose AM1707BZKBA3?

The AM1707BZKBA3 positions itself as a robust, highly integrated single‑core Sitara microprocessor for embedded and industrial designs that require a balance of general‑purpose processing, real‑time control and diverse I/O. With Ethernet, USB OTG, multimedia peripherals, flexible external memory support and PRU offload capability, it addresses designs that need integrated connectivity plus deterministic performance.

Its industrial temperature rating and compact 256‑BGA package make it suitable for deployed systems demanding durability and compact board footprint. The combination of on‑chip peripherals and DMA resources helps reduce BOM complexity while enabling reliable long‑term operation in fielded products.

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