AM1802BZCED3

IC MPU SITARA 300MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 361-NFBGA (13x13)

Quantity 1,116 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM18xx
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSystem Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersLPDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed300MHzSupplier Device Package361-NFBGA (13×13)USBUSB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of AM1802BZCED3 – IC MPU SITARA 300MHZ 361NFBGA

The AM1802BZCED3 is a Sitara AM18xx series ARM microprocessor featuring a single ARM926EJ‑S 32‑bit core running at 300 MHz. Designed as a low‑power applications processor, it integrates a broad set of peripherals and memory interfaces for embedded and industrial systems.

Targeted at markets such as medical, healthcare & fitness, ePOS and building automation, the device combines processing performance with integrated connectivity and memory support to simplify system design and accelerate time to market.

Key Features

  • Core & Performance  ARM926EJ‑S single 32‑bit core clocked at 300 MHz with 16 KB instruction cache and 16 KB data cache to support responsive embedded applications.
  • On‑chip Memory  Includes 128 KB of on‑chip memory, 64 KB of ROM, and 8 KB of RAM for vector/table storage to streamline boot and control code.
  • Memory Interfaces  Two external memory interfaces including EMIFA for NOR/NAND and a DDR2/mobile DDR memory controller; supports LPDDR and DDR2 memory types for flexible system memory design.
  • Storage & Connectivity  Integrated 10/100 Mbps Ethernet MAC, SATA 3 Gbps interface, and USB 2.0 OTG with integrated PHY to cover common wired connectivity and mass‑storage needs.
  • Peripheral & I/O  Includes LCD display controller, multiple UARTs (16550‑type), SPI, I2C, MMC/SD/SDIO host interfaces and a multichannel McASP audio port for diverse peripheral integration.
  • DMA & Timers  Enhanced DMA controller (EDMA3) with numerous channels and configurable timers for efficient data movement and timekeeping in real‑time applications.
  • Real‑Time & System Support  Real‑time clock with separate 32‑kHz oscillator and Embedded ICE‑RT debug support to facilitate development and power/clock management.
  • Industrial Grade & Temperature Range  Industrial grade device rated for operation from −40 °C to 90 °C, suitable for demanding embedded environments.
  • Package & Mounting  361‑ball NFBGA supplier package (13 × 13 mm) with surface‑mount assembly for compact board designs; package variant information available in ordering codes.
  • Standards & Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Medical, Healthcare & Fitness  Used for device control, sensor interfacing and user‑facing applications where low power and integrated peripherals simplify design.
  • ePOS Systems  Provides networking, storage and display support required for point‑of‑sale terminals and transaction devices.
  • Building Automation  Enables control and connectivity tasks—networking, I/O and real‑time control—across HVAC, access and monitoring systems.
  • Embedded Industrial Equipment  Industrial temperature rating and mixed memory/peripheral support make it suitable for compact controllers and instrumentation.

Unique Advantages

  • Highly integrated connectivity: Ethernet, SATA and USB 2.0 OTG with PHY reduce external components for networked and storage‑capable designs.
  • Flexible memory support: EMIFA plus DDR2/mDDR/LPDDR controller support allows designers to choose memory types that match performance and cost targets.
  • Real‑time and DMA capabilities: EDMA3 controller and multiple timers offload data movement and timing tasks, improving system responsiveness and CPU efficiency.
  • Compact industrial package: 361‑ball NFBGA (13×13) package enables dense, space‑constrained PCB layouts while supporting industrial temperature operation.
  • Developer support features: On‑chip ROM, RAM for vectors, RTC and Embedded ICE‑RT debug support simplify bring‑up and firmware development.
  • Environmental compliance: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose AM1802BZCED3?

The AM1802BZCED3 positions itself as a practical, integrated processor option for embedded and industrial applications that need a balance of processing capability, peripheral integration and robust I/O. With a 300 MHz ARM926EJ‑S core, comprehensive memory interface options and built‑in connectivity (Ethernet, SATA, USB), it reduces BOM complexity and accelerates development of connected, storage‑enabled systems.

This device is well suited for OEMs and ODMs developing compact, industrial‑qualified products—where predictable performance, development support and long‑term availability of a Sitara AM18xx family device deliver engineering and procurement advantages.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for AM1802BZCED3. Our team can provide ordering details and help match this device to your design requirements.

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