AM3354BZCZD30

IC MPU SITARA 300MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 324-NFBGA (15x15)

Quantity 620 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusDiscontinued at Digi-Key
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1 TIEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3354BZCZD30 – IC MPU SITARA 300MHZ 324NFBGA

The AM3354BZCZD30 is an ARM® Cortex®-A8 based Sitara™ microprocessor featuring a single 32‑bit core running at 300 MHz. Designed for industrial embedded applications, it combines a general-purpose processor core with multimedia DSP capabilities and a range of integrated interfaces to simplify system design.

Key value propositions include integrated connectivity (dual Gigabit Ethernet, USB 2.0 with PHY, CAN), flexible memory controller support, display and touchscreen controllers, and hardware security primitives—packaged in a 324‑NFBGA (15×15 mm) surface-mount package rated for industrial temperatures.

Key Features

  • Core and DSP Single ARM® Cortex®-A8 32‑bit core at 300 MHz with multimedia DSP support and NEON™ SIMD acceleration for media and compute tasks.
  • Memory Controllers Supports LPDDR, DDR2, DDR3 and DDR3L memory types for flexible system memory design and scalability.
  • Display and Touch Integrated LCD and touchscreen display interface controllers suitable for user‑interface and HMI applications.
  • Ethernet Two 10/100/1000 Mbps Ethernet interfaces enabling dual‑port wired networking and high‑throughput connectivity.
  • USB Two USB 2.0 ports with integrated PHY for device and host connectivity.
  • Additional Interfaces On‑chip CAN interface for robust control and sensor network integration.
  • Security Features Hardware cryptography and a random number generator for secure communications and trusted applications.
  • Graphics Acceleration Integrated graphics acceleration to support GUI rendering and multimedia playback.
  • Package and Mounting 324‑NFBGA supplier device package (15×15 mm), surface‑mount mounting type; package case listed as 324‑LFBGA.
  • Industrial Grade & Temperature Rated for industrial operation from −40 °C to 90 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Industrial HMI — Drives LCD/touchscreen user interfaces and GUI graphics with integrated display controllers and graphics acceleration.
  • Embedded Networking — Dual Gigabit Ethernet and CAN support wired networking tasks, protocol gateways, and industrial communications.
  • Multimedia and Imaging — NEON™ SIMD and multimedia DSP capabilities enable codec acceleration and media processing in compact systems.
  • IoT Gateways and Controllers — USB, Ethernet, and memory flexibility make it suitable for edge compute, protocol bridging, and controller applications.

Unique Advantages

  • Balanced compute and media capability: 300 MHz ARM Cortex‑A8 core combined with NEON™ SIMD and multimedia DSP support for mixed application workloads.
  • Broad memory compatibility: Support for LPDDR, DDR2, DDR3 and DDR3L lets designers choose memory density and power characteristics to match system needs.
  • Integrated multi‑interface connectivity: Dual GigE, dual USB 2.0 with PHY and CAN reduce external controller requirements and simplify BOM.
  • Display subsystem included: On‑chip LCD and touchscreen controllers lower component count for HMIs and embedded displays.
  • Industrial temperature rating: −40 °C to 90 °C specification supports deployment in harsh or temperature‑sensitive environments.
  • Hardware security primitives: Built‑in cryptography and RNG support secure communication and device authentication without separate security ICs.

Why Choose AM3354BZCZD30?

The AM3354BZCZD30 delivers a practical combination of processor performance, multimedia capability, and integrated peripheral interfaces tailored for industrial embedded designs. Its single ARM® Cortex®-A8 core, NEON™ SIMD support, and dedicated display and connectivity controllers help reduce system complexity and component count.

This part is appropriate for designers seeking an industrial‑grade, surface‑mount microprocessor in a 324‑NFBGA package that consolidates networking, USB, CAN, display, and memory interfaces while providing hardware security features and RoHS compliance.

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