AM3354BZCZD60

IC MPU SITARA 600MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15)

Quantity 690 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed600MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3354BZCZD60 – IC MPU SITARA 600MHZ 324NFBGA

The AM3354BZCZD60 is a Sitara AM335x series microprocessor from Texas Instruments featuring a single ARM® Cortex®-A8 32‑bit core running at 600 MHz. Designed for embedded and industrial applications, it integrates multimedia acceleration, multiple memory controller options, and a broad set of connectivity interfaces to support networked and human‑machine interface designs.

Key Features

  • Core Single ARM® Cortex®-A8 32‑bit core at 600 MHz for general-purpose embedded processing.
  • Co‑processors and Acceleration Multimedia DSP capabilities and NEON™ SIMD provide acceleration for compute‑intensive multimedia tasks; graphics acceleration is included.
  • Memory Interfaces Integrated memory controllers supporting LPDDR, DDR2, DDR3 and DDR3L provide flexibility for a range of system memory configurations.
  • Display and HMI Display interface controllers for LCDs and touchscreens enable direct connection to user interfaces and panels.
  • Connectivity Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports with PHY, and CAN support a wide range of wired communications and network topologies.
  • Security On‑chip cryptography features and a random number generator provide hardware building blocks for secure applications.
  • Package and Mounting Available in a 324‑NFBGA (15 × 15 mm) surface‑mount package (supplier device package) suitable for compact board designs.
  • Operating Range Rated for industrial operation from −40 °C to 90 °C, supporting deployment in temperature‑challenging environments.
  • Grade Industrial grade device tailored to embedded system requirements.

Typical Applications

  • Industrial Control and Automation — Industrial grade operation and dual Gigabit Ethernet plus CAN support networked controllers and remote I/O systems.
  • Human‑Machine Interfaces (HMIs) — LCD and touchscreen controllers with graphics acceleration enable responsive operator panels and display subsystems.
  • Multimedia and Embedded Vision — NEON™ SIMD and multimedia DSP support media processing tasks within embedded products.
  • Networked Embedded Gateways — Dual Ethernet, USB 2.0 with PHY, and security features make it suitable for protocol bridging and secure edge devices.

Unique Advantages

  • High‑performance single‑core processing: 600 MHz ARM® Cortex®‑A8 core delivers deterministic 32‑bit processing for control and application tasks.
  • Flexible memory support: Controllers for LPDDR, DDR2, DDR3 and DDR3L simplify system memory selection and scaling.
  • Comprehensive connectivity: Dual Gigabit Ethernet, dual USB 2.0 with PHY and CAN provide multiple wired interfaces for industrial and networked systems.
  • Built‑in security primitives: Cryptography support and a random number generator help integrate hardware security without external accelerators.
  • Display and multimedia enablement: LCD/touchscreen controllers plus graphics acceleration support rich user interfaces and media features.
  • Industrial temperature and compact package: Surface‑mount 324‑NFBGA (15×15 mm) package combined with −40 °C to 90 °C rating supports compact, rugged designs.

Why Choose AM3354BZCZD60?

The AM3354BZCZD60 combines a 600 MHz ARM® Cortex®‑A8 core with multimedia acceleration, flexible memory interfaces, and multiple high‑speed connectivity options in an industrial‑grade package. It is suited for embedded designers who need a compact, networked processor platform with display and security capabilities.

This device is appropriate for designs that require a balance of application processing, multimedia support, and on‑board connectivity while operating across an industrial temperature range.

Request a quote or submit a pricing inquiry to check availability and obtain tailored pricing and lead‑time details for the AM3354BZCZD60.

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