AM3354ZCED50

IC MPU SITARA 500MHZ 298NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 500MHz 298-NFBGA (13x13)

Quantity 890 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package298-NFBGA (13x13)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1 TIEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case298-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed500MHzSupplier Device Package298-NFBGA (13×13)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3354ZCED50 – IC MPU SITARA 500MHZ 298NFBGA

The AM3354ZCED50 is a Sitara AM335x microprocessor from Texas Instruments featuring a single ARM® Cortex®-A8 32‑bit core running at 500 MHz. It is targeted for embedded applications that require integrated connectivity, display support and multimedia acceleration.

With on-chip multimedia/NEON SIMD co‑processing, Gigabit Ethernet, USB 2.0 PHYs, multiple memory controller options and hardware security primitives, this device balances compute capability and system integration in a compact 298‑ball NFBGA (13×13) package.

Key Features

  • CPU Core ARM® Cortex®-A8 single core, 32‑bit operating at 500 MHz, suitable for general embedded compute tasks.
  • Multimedia Acceleration Integrated multimedia co‑processor with NEON™ SIMD support to accelerate signal and media processing workloads.
  • Memory Interfaces Flexible memory controller support for LPDDR, DDR2, DDR3 and DDR3L memories to accommodate a range of system memory configurations.
  • Display and Graphics On‑chip display interface controllers for LCD and touchscreen integration and graphics acceleration for user interfaces.
  • High‑Speed Connectivity Dual Ethernet ports capable of 10/100/1000 Mbps and two USB 2.0 ports with PHY to enable wired networking and host/device USB connectivity.
  • Peripheral Interfaces Additional interfaces include CAN, enabling integration with common embedded communication buses.
  • Security Hardware cryptography engine and a random number generator to support secure communications and protected storage use cases.
  • Package and Mounting Supplied in a 298‑ball NFBGA (13×13) package; 298‑LFBGA noted as package case, with surface‑mount mounting type.
  • Operating Grade Commercial grade device with an operating temperature range of 0 °C to 90 °C.

Typical Applications

  • Embedded Networking Dual Gigabit Ethernet and USB 2.0 PHYs enable use in networked embedded gateways and communication appliances.
  • Human‑Machine Interfaces (HMI) LCD/touchscreen controllers and graphics acceleration support display and UI control in operator panels and touchscreen devices.
  • Industrial Control CAN interface, security features and multiple memory options make the device suitable for embedded control and monitoring systems.

Unique Advantages

  • Single‑chip integration: Combines a 500 MHz Cortex‑A8 core with multimedia co‑processing, connectivity and display controllers to reduce external component count.
  • Broad memory support: Native controllers for LPDDR, DDR2, DDR3 and DDR3L allow designers to select memory types that match performance and cost targets.
  • Robust connectivity: Dual 10/100/1000 Mbps Ethernet ports plus two USB 2.0 PHYs and CAN provide multiple wired communication options without external controllers.
  • Security primitives: On‑chip cryptography and a random number generator help implement secure boot, communications and data protection.
  • Compact, manufacturable package: 298‑ball NFBGA (13×13) surface‑mount package supports high‑density board designs.
  • Commercial temperature operation: Rated for 0 °C to 90 °C for a wide set of commercial embedded deployments.

Why Choose AM3354ZCED50?

The AM3354ZCED50 delivers a balanced platform for embedded applications that need CPU performance, multimedia acceleration and integrated connectivity in a single package. Its Cortex‑A8 core, NEON SIMD support, flexible memory interfaces and multiple high‑speed peripherals make it suitable for designs requiring user interfaces, network connectivity and secure communications.

Backed by Texas Instruments' Sitara AM335x product family, this device provides a compact, integrated option for developers and engineers building commercial embedded systems that benefit from reduced BOM complexity and a broad set of on‑chip features.

Request a quote or submit an inquiry to obtain pricing and availability for the AM3354ZCED50 for your next embedded design.

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