AM5729BABCXA
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 1,163 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM57xx |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | DSP, BB2D, IPU, IVA, GPU, VPE | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Ethernet | GbE (2) | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 760-BFBGA, FCBGA | RAM Controllers | DDR3, SRAM | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Speed | 1.5GHz | Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 (1), USB 3.0 (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of AM5729BABCXA – IC MPU SITARA 1.5GHZ 760FCBGA
The AM5729BABCXA is a Sitara™ microprocessor IC featuring dual ARM® Cortex®-A15 cores running at 1.5 GHz. Designed for embedded and industrial applications, it combines general-purpose processing with integrated multimedia and accelerator blocks for system-level consolidation.
This device targets embedded and industrial systems where processing performance, on-chip acceleration and broad I/O integration are required. It is offered in a 760-ball FCBGA package and carries industrial-grade qualification including AEC‑Q100 and a specified operating temperature range of −40 °C to 105 °C.
Key Features
- Core Dual ARM® Cortex®-A15 32‑bit cores at 1.5 GHz for multi-threaded application processing and control tasks.
- Integrated Co‑processors and Accelerators On-chip DSP, BB2D, IPU, IVA, GPU and VPE blocks provide dedicated acceleration for signal processing, imaging and video tasks.
- Memory Controllers Built-in DDR3 and SRAM controller support for system memory interfaces and high-bandwidth access.
- Interfaces — Networking & Connectivity Dual Gigabit Ethernet ports and CAN support enable high-throughput networking and fieldbus connectivity for embedded systems.
- Storage & USB Integrated SATA 3 Gbps port plus USB 3.0 and USB 2.0 controllers provide flexible local storage and host/device connectivity options.
- Graphics & Multimedia Graphics acceleration and image/video processing units (IPU, VPE) support HMI, imaging and multimedia workloads.
- Package & Mounting 760‑ball FCBGA (23×23) surface‑mount package for compact board-level integration.
- Reliability & Grade Industrial grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C for demanding environments.
- Compliance RoHS‑compliant construction for regulatory and environmental requirements.
Typical Applications
- Industrial Automation Use dual-core processing, GbE and CAN connectivity to run control logic, communications and local HMI tasks in industrial equipment.
- Imaging and Vision Systems On-chip IPU, VPE and GPU accelerators support image capture, processing and display pipelines for vision applications.
- Networking and Communication Appliances Dual Gigabit Ethernet and USB 3.0 enable high-throughput data movement and peripheral connectivity for embedded network devices.
- Human–Machine Interfaces (HMI) Graphics acceleration and multimedia blocks allow responsive graphical interfaces and multimedia playback in embedded displays and control panels.
Unique Advantages
- High-performance dual-core architecture: Dual ARM® Cortex®-A15 cores at 1.5 GHz deliver the compute headroom required for control, signal processing and application workloads.
- Rich on-chip acceleration: DSP, IVA, IPU, VPE and GPU blocks reduce external component count by handling multimedia, vision and signal-processing tasks on-chip.
- Broad, integrated connectivity: GbE, SATA, USB 3.0/2.0 and CAN provide multiple high-speed interfaces for networking, storage and fieldbus integration.
- Industrial and AEC qualification: Industrial grade classification with AEC‑Q100 qualification and a −40 °C to 105 °C operating range supports deployment in harsh environments.
- Compact BGA footprint: 760‑ball FCBGA (23×23) package enables dense board designs with surface-mount assembly.
- Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose AM5729BABCXA?
The AM5729BABCXA positions itself as a highly integrated embedded processor combining dual ARM® Cortex®-A15 performance with a suite of multimedia and accelerator blocks plus extensive I/O. Its industrial grade and AEC‑Q100 qualification, together with a wide operating temperature range, make it suitable for demanding embedded deployments that require longevity and environmental robustness.
This part is appropriate for designs that need consolidated processing, vision/multimedia acceleration and diverse connectivity in a compact FCBGA package—delivering a balance of compute capability and system-level integration for embedded and industrial product families.
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