AM5729BABCXA

IC MPU SITARA 1.5GHZ 760FCBGA
Part Description

ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,163 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM57xx
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPDSP, BB2D, IPU, IVA, GPU, VPECore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
ECCN5A992CEthernetGbE (2)GradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case760-BFBGA, FCBGARAM ControllersDDR3, SRAM
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (1), USB 3.0 (1)
Voltage – I/O1.8V, 3.3V

Overview of AM5729BABCXA – IC MPU SITARA 1.5GHZ 760FCBGA

The AM5729BABCXA is a Sitara™ microprocessor IC featuring dual ARM® Cortex®-A15 cores running at 1.5 GHz. Designed for embedded and industrial applications, it combines general-purpose processing with integrated multimedia and accelerator blocks for system-level consolidation.

This device targets embedded and industrial systems where processing performance, on-chip acceleration and broad I/O integration are required. It is offered in a 760-ball FCBGA package and carries industrial-grade qualification including AEC‑Q100 and a specified operating temperature range of −40 °C to 105 °C.

Key Features

  • Core  Dual ARM® Cortex®-A15 32‑bit cores at 1.5 GHz for multi-threaded application processing and control tasks.
  • Integrated Co‑processors and Accelerators  On-chip DSP, BB2D, IPU, IVA, GPU and VPE blocks provide dedicated acceleration for signal processing, imaging and video tasks.
  • Memory Controllers  Built-in DDR3 and SRAM controller support for system memory interfaces and high-bandwidth access.
  • Interfaces — Networking & Connectivity  Dual Gigabit Ethernet ports and CAN support enable high-throughput networking and fieldbus connectivity for embedded systems.
  • Storage & USB  Integrated SATA 3 Gbps port plus USB 3.0 and USB 2.0 controllers provide flexible local storage and host/device connectivity options.
  • Graphics & Multimedia  Graphics acceleration and image/video processing units (IPU, VPE) support HMI, imaging and multimedia workloads.
  • Package & Mounting  760‑ball FCBGA (23×23) surface‑mount package for compact board-level integration.
  • Reliability & Grade  Industrial grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C for demanding environments.
  • Compliance  RoHS‑compliant construction for regulatory and environmental requirements.

Typical Applications

  • Industrial Automation  Use dual-core processing, GbE and CAN connectivity to run control logic, communications and local HMI tasks in industrial equipment.
  • Imaging and Vision Systems  On-chip IPU, VPE and GPU accelerators support image capture, processing and display pipelines for vision applications.
  • Networking and Communication Appliances  Dual Gigabit Ethernet and USB 3.0 enable high-throughput data movement and peripheral connectivity for embedded network devices.
  • Human–Machine Interfaces (HMI)  Graphics acceleration and multimedia blocks allow responsive graphical interfaces and multimedia playback in embedded displays and control panels.

Unique Advantages

  • High-performance dual-core architecture: Dual ARM® Cortex®-A15 cores at 1.5 GHz deliver the compute headroom required for control, signal processing and application workloads.
  • Rich on-chip acceleration: DSP, IVA, IPU, VPE and GPU blocks reduce external component count by handling multimedia, vision and signal-processing tasks on-chip.
  • Broad, integrated connectivity: GbE, SATA, USB 3.0/2.0 and CAN provide multiple high-speed interfaces for networking, storage and fieldbus integration.
  • Industrial and AEC qualification: Industrial grade classification with AEC‑Q100 qualification and a −40 °C to 105 °C operating range supports deployment in harsh environments.
  • Compact BGA footprint: 760‑ball FCBGA (23×23) package enables dense board designs with surface-mount assembly.
  • Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose AM5729BABCXA?

The AM5729BABCXA positions itself as a highly integrated embedded processor combining dual ARM® Cortex®-A15 performance with a suite of multimedia and accelerator blocks plus extensive I/O. Its industrial grade and AEC‑Q100 qualification, together with a wide operating temperature range, make it suitable for demanding embedded deployments that require longevity and environmental robustness.

This part is appropriate for designs that need consolidated processing, vision/multimedia acceleration and diverse connectivity in a compact FCBGA package—delivering a balance of compute capability and system-level integration for embedded and industrial product families.

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