AM5729BABCXEA

IC MPU SITARA 1.5GHZ 760FCBGA
Part Description

ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,130 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM57xx
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPDSP, BB2D, IPU, IVA, GPU, VPECore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
ECCN5A992CEthernetGbE (2)GradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case760-BFBGA, FCBGARAM ControllersDDR3, SRAM
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (1), USB 3.0 (1)
Voltage – I/O1.8V, 3.3V

Overview of AM5729BABCXEA – IC MPU SITARA 1.5GHZ 760FCBGA

The AM5729BABCXEA is a Sitara AM57xx series microprocessor IC from Texas Instruments featuring dual ARM® Cortex®-A15 cores at 1.5 GHz and a 32‑bit architecture. Designed for embedded and industrial applications, it combines high-performance processing with integrated multimedia and connectivity blocks to address networking, imaging, storage and control use cases.

With support for DDR3 and SRAM memory controllers, multiple Ethernet ports, SATA and USB interfaces, and hardware accelerators, this device targets designs that require a balance of compute, peripheral integration and industrial-grade reliability.

Key Features

  • Core & Performance  Dual ARM® Cortex®-A15 cores at 1.5 GHz providing 32‑bit processing for compute-intensive embedded tasks.
  • Multimedia & Acceleration  Integrated co-processors including DSP, BB2D, IPU, IVA, GPU and VPE to accelerate imaging, video and signal-processing workloads.
  • Memory Interfaces  On-chip support for DDR3 and SRAM memory controllers to serve system and application memory needs.
  • High-Speed Connectivity  Dual Gigabit Ethernet interfaces (GbE) for robust networking and one SATA 3 Gbps port for storage connectivity.
  • Peripheral I/O  USB 3.0 and USB 2.0 ports plus CAN support for a wide range of peripheral and vehicle-bus interfaces.
  • Package & Mounting  Supplied in a 760‑FCBGA (23×23) surface‑mount package suitable for compact board designs.
  • Industrial Grade & Temperature Range  Industrial-grade device with an operating temperature range of -40 °C to 105 °C for extended-environment deployment.
  • Qualification & Compliance  AEC-Q100 qualification and RoHS compliance for regulated and reliability-conscious applications.
  • Graphics Acceleration  On-chip graphics acceleration capabilities to support GUI and visual-processing tasks.

Typical Applications

  • Industrial Control: Embedded controllers and automation platforms that require sustained processing, deterministic connectivity and industrial temperature operation.
  • Automotive Systems: Vehicle electronic subsystems leveraging AEC‑Q100 qualification, CAN and Ethernet connectivity for infotainment or domain controllers.
  • Imaging & Vision: Vision processors and camera subsystems that benefit from IPU, IVA and GPU acceleration for image capture and processing.
  • Networking & Communications: Gateways, routers and edge networking appliances using dual GbE interfaces and integrated processing for packet handling and protocol stacks.
  • Storage-Enabled Embedded Devices: Systems requiring local storage or high-speed peripheral access via SATA and USB 3.0.

Unique Advantages

  • Balanced Dual-Core Performance: Two ARM® Cortex®-A15 cores at 1.5 GHz deliver multi-threaded processing capacity while keeping the design compact.
  • Integrated Multimedia Acceleration: DSP, IVA, IPU, GPU and VPE blocks reduce software overhead for imaging, video and signal-processing workflows.
  • Comprehensive I/O Suite: GbE, SATA, USB and CAN provide a broad set of connectivity options to simplify system integration and reduce external components.
  • Industrial and Automotive-Grade Qualification: AEC‑Q100 qualification and a -40 °C to 105 °C operating range support deployment in demanding environments.
  • Compact FCBGA Packaging: 760‑FCBGA (23×23) surface‑mount package enables dense board layouts for space-constrained applications.
  • Regulatory Compliance: RoHS compliance supports designs targeting regulated markets and streamlined manufacturing requirements.

Why Choose AM5729BABCXEA?

The AM5729BABCXEA positions itself as a high-performance, highly integrated MPU for embedded and industrial designs that need a mix of compute, multimedia acceleration and diverse connectivity. Its dual ARM® Cortex®-A15 cores, integrated co-processors and broad interface set allow engineers to consolidate functionality while maintaining rugged operation across -40 °C to 105 °C.

Manufactured by Texas Instruments and supplied in a compact 760‑FCBGA (23×23) surface-mount package with AEC‑Q100 qualification and RoHS compliance, this device is suitable for projects that require long-term reliability, integration and a strong set of on-chip peripherals.

Request a quote or submit a procurement inquiry to begin specifying AM5729BABCXEA for your next embedded or industrial design.

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