AM5729BABCXEA
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 1,130 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM57xx |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | DSP, BB2D, IPU, IVA, GPU, VPE | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Ethernet | GbE (2) | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 760-BFBGA, FCBGA | RAM Controllers | DDR3, SRAM | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Speed | 1.5GHz | Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 (1), USB 3.0 (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of AM5729BABCXEA – IC MPU SITARA 1.5GHZ 760FCBGA
The AM5729BABCXEA is a Sitara AM57xx series microprocessor IC from Texas Instruments featuring dual ARM® Cortex®-A15 cores at 1.5 GHz and a 32‑bit architecture. Designed for embedded and industrial applications, it combines high-performance processing with integrated multimedia and connectivity blocks to address networking, imaging, storage and control use cases.
With support for DDR3 and SRAM memory controllers, multiple Ethernet ports, SATA and USB interfaces, and hardware accelerators, this device targets designs that require a balance of compute, peripheral integration and industrial-grade reliability.
Key Features
- Core & Performance Dual ARM® Cortex®-A15 cores at 1.5 GHz providing 32‑bit processing for compute-intensive embedded tasks.
- Multimedia & Acceleration Integrated co-processors including DSP, BB2D, IPU, IVA, GPU and VPE to accelerate imaging, video and signal-processing workloads.
- Memory Interfaces On-chip support for DDR3 and SRAM memory controllers to serve system and application memory needs.
- High-Speed Connectivity Dual Gigabit Ethernet interfaces (GbE) for robust networking and one SATA 3 Gbps port for storage connectivity.
- Peripheral I/O USB 3.0 and USB 2.0 ports plus CAN support for a wide range of peripheral and vehicle-bus interfaces.
- Package & Mounting Supplied in a 760‑FCBGA (23×23) surface‑mount package suitable for compact board designs.
- Industrial Grade & Temperature Range Industrial-grade device with an operating temperature range of -40 °C to 105 °C for extended-environment deployment.
- Qualification & Compliance AEC-Q100 qualification and RoHS compliance for regulated and reliability-conscious applications.
- Graphics Acceleration On-chip graphics acceleration capabilities to support GUI and visual-processing tasks.
Typical Applications
- Industrial Control: Embedded controllers and automation platforms that require sustained processing, deterministic connectivity and industrial temperature operation.
- Automotive Systems: Vehicle electronic subsystems leveraging AEC‑Q100 qualification, CAN and Ethernet connectivity for infotainment or domain controllers.
- Imaging & Vision: Vision processors and camera subsystems that benefit from IPU, IVA and GPU acceleration for image capture and processing.
- Networking & Communications: Gateways, routers and edge networking appliances using dual GbE interfaces and integrated processing for packet handling and protocol stacks.
- Storage-Enabled Embedded Devices: Systems requiring local storage or high-speed peripheral access via SATA and USB 3.0.
Unique Advantages
- Balanced Dual-Core Performance: Two ARM® Cortex®-A15 cores at 1.5 GHz deliver multi-threaded processing capacity while keeping the design compact.
- Integrated Multimedia Acceleration: DSP, IVA, IPU, GPU and VPE blocks reduce software overhead for imaging, video and signal-processing workflows.
- Comprehensive I/O Suite: GbE, SATA, USB and CAN provide a broad set of connectivity options to simplify system integration and reduce external components.
- Industrial and Automotive-Grade Qualification: AEC‑Q100 qualification and a -40 °C to 105 °C operating range support deployment in demanding environments.
- Compact FCBGA Packaging: 760‑FCBGA (23×23) surface‑mount package enables dense board layouts for space-constrained applications.
- Regulatory Compliance: RoHS compliance supports designs targeting regulated markets and streamlined manufacturing requirements.
Why Choose AM5729BABCXEA?
The AM5729BABCXEA positions itself as a high-performance, highly integrated MPU for embedded and industrial designs that need a mix of compute, multimedia acceleration and diverse connectivity. Its dual ARM® Cortex®-A15 cores, integrated co-processors and broad interface set allow engineers to consolidate functionality while maintaining rugged operation across -40 °C to 105 °C.
Manufactured by Texas Instruments and supplied in a compact 760‑FCBGA (23×23) surface-mount package with AEC‑Q100 qualification and RoHS compliance, this device is suitable for projects that require long-term reliability, integration and a strong set of on-chip peripherals.
Request a quote or submit a procurement inquiry to begin specifying AM5729BABCXEA for your next embedded or industrial design.

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