AM5746ABZYA
| Part Description |
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 67 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM57xx |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, C66x | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, LCD, Video | ECCN | N/A | Ethernet | GbE (2) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 760-LFBGA, FCBGA | ||
| RAM Controllers | DDR3, DDR3L | REACH Compliance | REACH Unknown | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (1) | Security Features | 3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG | Speed | 1.5GHz | ||
| Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 (2), USB 3.0 (2) | Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of AM5746ABZYA – IC MPU SITARA 1.5GHZ 760FCBGA
The AM5746ABZYA is a Sitara™ microprocessor IC featuring dual ARM® Cortex®-A15 cores running at 1.5 GHz in a 760-FCBGA (23×23) package. It combines high-performance application processors with a broad set of integrated subsystems for embedded and industrial designs.
Designed for applications that require multimedia, networking, and real-time control, the device integrates memory interfaces, video and display subsystems, industrial connectivity, and hardware security capabilities to simplify system design and accelerate time to market.
Key Features
- Processor Cores Dual ARM® Cortex®-A15 cores at 1.5 GHz providing 32‑bit application processing for compute-intensive embedded tasks.
- Coprocessors & Real‑time Engines Integrated ARM® Cortex®-M4 cores and up to two C66x DSP cores, plus dual-core PRU‑ICSS subsystems for deterministic real-time and industrial communications.
- On‑chip Memory & External Memory Interfaces Up to 2.5 MB of on-chip L3 RAM and two DDR3/DDR3L EMIFs supporting rates up to DDR3‑1333 with ECC supported on the primary EMIF.
- Video and Graphics Subsystem Display subsystem with HDMI/DVI support and multimedia accelerators including IVA‑HD (4K @ 15 fps encode/decode) and 2D/3D graphics engines for advanced user interfaces and video processing workloads.
- Storage and USB SATA Gen2 (3 Gbps) interface and dual-role SuperSpeed USB 3.0 plus High Speed USB 2.0 ports for storage and high-bandwidth peripherals.
- Networking Integrated two-port Gigabit Ethernet switch (GbE ×2) and multiple CAN/MCAN options for industrial and networked applications.
- High‑Speed I/O and Expansion PCIe subsystems with up to two 5‑Gbps lanes, QSPI, McSPI, McASP and multiple SD/MMC/SDIO interfaces for expansion and multimedia I/O.
- Security and Trust Hardware security features including AES, 3DES, MD5, SHA-1/2, TRNG, secure boot and Arm TrustZone® support for isolated execution and cryptographic acceleration.
- Package & Environmental 760‑FCBGA (23×23) surface‑mount package; industrial grade with operating temperature range of −40 °C to 105 °C and RoHS compliance.
- Qualification AEC‑Q100 qualification is listed for designs that require that level of component qualification.
Typical Applications
- Industrial Automation Real-time control and industrial communications leveraging PRU‑ICSS, multiple Ethernet ports, and CAN connectivity for deterministic I/O and fieldbus integration.
- Multimedia and Vision Systems Video capture, encode/decode and display applications using the IVA‑HD subsystem, HDMI output, and integrated graphics to implement advanced HMI and vision pipelines.
- Networking and Storage Appliances Networked devices and appliance controllers that combine dual GbE, SATA, USB 3.0 and PCIe for routing, gateway and local storage functions.
- Automotive & Transportation Electronics Suitable for automotive and transportation designs where AEC‑Q100 qualification and industrial temperature range are required.
Unique Advantages
- High compute and DSP capability: Dual Cortex‑A15 cores plus C66x DSPs and M4 coprocessors enable heterogeneous compute for mixed workloads (application processing, signal processing, and control).
- Integrated multimedia stack: IVA‑HD, 2D/3D graphics and HDMI support reduce external component needs for video and display subsystems.
- Comprehensive connectivity: Built‑in GbE switching, SATA, USB 3.0/2.0, PCIe and multiple serial interfaces simplify system architecture and reduce board-level complexity.
- Security and trusted boot: On‑chip cryptographic engines, TRNG and secure boot/TrustZone support enable hardware-enforced root of trust for secure device deployment.
- Industrial robustness: Industrial grade temperature range (−40 °C to 105 °C), AEC‑Q100 qualification, and RoHS compliance support long-term, reliable deployments.
- Memory flexibility: Dual EMIFs with DDR3/DDR3L support and on-chip L3 RAM provide scalable memory performance and ECC support for critical applications.
Why Choose AM5746ABZYA?
The AM5746ABZYA positions itself as a highly integrated Sitara processor for embedded and industrial designs that require a balance of application performance, real‑time control, multimedia processing, and broad connectivity. Its dual Cortex‑A15 cores at 1.5 GHz, coupled with DSP and M4 coprocessors, deliver the compute diversity needed for complex, mixed workloads.
With onboard security features, extensive I/O, industrial temperature operation, and AEC‑Q100 qualification, this device targets designs that must meet stringent reliability and long‑term deployment requirements while minimizing external components and development effort.
Request a quote or submit a procurement inquiry to get pricing and availability for AM5746ABZYA and to discuss lead times and volume options.

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