ATSAMA5D22B-CUR

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 1,332 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D22B-CUR – IC MPU SAMA5D2 500MHz 196TFBGA

The ATSAMA5D22B-CUR is an ARM® Cortex®-A5 based microprocessor IC operating at 500 MHz in a 196-TFBGA (11×11) package. It targets embedded and industrial applications that require a single 32-bit core with integrated multimedia and security capabilities.

With broad memory interface support, built-in display and peripheral controllers, industrial-grade temperature range, and a suite of hardware security features, this device is suited for designs needing a compact, secure, and connected processing element.

Key Features

  • Core  ARM® Cortex®-A5 single 32-bit core running at 500 MHz, delivering deterministic processing for embedded workloads.
  • Co-processors  Multimedia co-processor with NEON™ MPE for accelerated media and signal processing tasks.
  • Memory Support  Flexible memory controller support including LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI to match a range of system memory and flash configurations.
  • Display and HMI  Integrated display interface controllers for keyboard, LCD and touchscreen interfaces, plus graphics acceleration to enable responsive user interfaces.
  • Connectivity  On-chip 10/100 Mbps Ethernet (1 port), USB 2.0 with HSIC support, and I²C for common peripheral and networked application needs.
  • Security  Comprehensive hardware security features including ARM TrustZone, boot security, cryptography engines, RTIC, secure fusebox, secure JTAG, secure memory and a secure RTC.
  • Power and I/O  3.3 V I/O voltage for standard embedded interface compatibility.
  • Package and Mounting  196-TFBGA (11×11) CSBGA surface-mount package suitable for compact PCB designs.
  • Industrial Grade  Operating temperature range from −40 °C to 85 °C for industrial environments.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature rating and Ethernet connectivity make it applicable for embedded controllers and networked automation nodes.
  • Human–Machine Interfaces (HMI)  Display controllers and graphics acceleration support touchscreens and LCD-based operator panels with responsive UI needs.
  • Secure Connected Devices  Hardware security features combined with Ethernet and USB support enable secure edge devices and connected appliances.
  • Multimedia-Enabled Embedded Systems  NEON™ MPE and multimedia co-processor capabilities suit applications that require media processing in a compact single-core MPU.

Unique Advantages

  • Single-chip integration: Combines processing, display control, connectivity and security features to reduce BOM and simplify board design.
  • Flexible memory interfacing: Support for multiple DRAM generations and QSPI enables designers to choose the best memory topology for cost and performance.
  • Built-in security stack: Extensive hardware security primitives (TrustZone, secure boot, cryptography, secure JTAG, secure memory) to help protect device firmware and data.
  • Industrial robustness: −40 °C to 85 °C rating and industrial grade designation for reliable operation in harsh environments.
  • Compact package: 196-TFBGA (11×11) package allows a small PCB footprint while retaining a broad set of I/O and interfaces.
  • Integrated connectivity: 10/100 Mbps Ethernet, USB 2.0 + HSIC and I²C provide essential peripheral and network interfaces without external controllers.

Why Choose ATSAMA5D22B-CUR?

The ATSAMA5D22B-CUR offers a balanced combination of 500 MHz Cortex-A5 processing, multimedia acceleration, extensive memory support, and hardware security in a compact industrial-grade package. It positions itself for embedded designs that require integrated connectivity, HMI capabilities, and on-chip security while maintaining a small footprint.

Backed by Microchip Technology, this MPU is suited for engineers designing industrial controllers, secure IoT edge devices, and display-driven embedded systems that demand durable operation across a wide temperature range and flexible memory and peripheral options.

Request a quote or submit an inquiry to receive pricing and availability information for the ATSAMA5D22B-CUR and to discuss how it fits your next embedded design.

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