ATSAMA5D22C-CNR

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 1,054 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D22C-CNR – ARM Cortex‑A5 500 MHz MPU, 196‑TFBGA

The ATSAMA5D22C-CNR is an ARM® Cortex®-A5 microprocessor IC from the SAMA5D2 series, featuring a single 32-bit core running at 500 MHz in a 196‑TFBGA (11×11) package. Designed for embedded and industrial applications, it combines compute performance with integrated memory controllers, connectivity, display interfaces and hardware security features.

With industrial temperature rating and a compact surface-mount package, this MPU targets embedded systems that require secure boot, multimedia acceleration and flexible memory options while operating across a wide temperature range.

Key Features

  • Core — ARM® Cortex®-A5 single 32-bit core at 500 MHz providing deterministic processing for embedded workloads.
  • Memory Controllers — Built-in controllers for LPDDR1/LPDDR2/LPDDR3, DDR2, DDR3, DDR3L and QSPI, enabling flexible memory choices for performance and cost trade-offs.
  • Security — Comprehensive hardware security including ARM TrustZone (TZ), Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory and a Secure RTC to protect code and data.
  • Connectivity — Integrated 10/100 Mbps Ethernet interface (1) and USB 2.0 with HSIC support for common networking and peripheral connections.
  • Display & HMI — Display interface controllers for keyboard, LCD and touchscreen plus graphics acceleration to support human‑machine interfaces.
  • Multimedia Acceleration — Co-processors for multimedia and NEON™ MPE to accelerate signal and media processing tasks.
  • I/O and Peripherals — Additional interfaces including I2C for sensor and peripheral integration.
  • Power and Voltage — I/O voltage specified at 3.3 V for compatibility with common embedded I/O standards.
  • Package & Mounting — 196‑TFBGA (11×11) CSBGA supplier device package; surface mount for compact board designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 105 °C for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Embedded Systems — Industrial controllers and monitoring equipment that require an industrial temperature range and secure boot/cryptography.
  • Human‑Machine Interfaces (HMI) — Touchscreen and LCD interfaces with graphics acceleration for operator panels and control displays.
  • Secure Networked Devices — Embedded products needing Ethernet connectivity and hardware security features for protected communications and device integrity.
  • Multimedia and Signal Processing — Devices that benefit from multimedia co-processors and NEON™ MPE acceleration for media-related tasks.

Unique Advantages

  • Integrated Security Stack: Hardware features such as ARM TZ, Boot Security, Secure JTAG and Secure Fusebox provide multiple layers of device protection.
  • Flexible Memory Support: Wide support for LPDDR, DDR and QSPI memory types enables designers to optimize for cost, capacity or performance.
  • Compact Industrial Package: 196‑TFBGA surface-mount package (11×11) enables high‑density board layouts while supporting industrial temperature operation.
  • Rich Peripheral Set: On-chip Ethernet, USB 2.0 + HSIC, I2C and display controllers reduce external components and simplify system integration.
  • Multimedia Acceleration: NEON™ MPE and multimedia co-processors accelerate compute-intensive media and signal tasks, offloading the CPU.
  • Designed for Embedded Reliability: RoHS compliance and an operating range of −40 °C to 105 °C support long-term deployment in industrial environments.

Why Choose ATSAMA5D22C-CNR?

The ATSAMA5D22C-CNR delivers a balanced combination of 500 MHz ARM® Cortex®-A5 processing, extensive memory interface support, integrated connectivity and a comprehensive hardware security feature set—all in a compact 196‑TFBGA surface‑mount package. Its industrial temperature rating and RoHS compliance make it suitable for embedded systems that require reliable operation across harsh environments.

Backed by Microchip Technology's SAMA5D2 series, this part is appropriate for designers seeking a single‑core, secure MPU platform with graphics/display support and flexible memory options for industrial and embedded applications.

Request a quote or submit a product inquiry to obtain pricing, availability and technical support for the ATSAMA5D22C-CNR.

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