ATSAMA5D23A-CN

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 885 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D23A-CN – IC MPU SAMA5D2 500MHZ 196TFBGA

The ATSAMA5D23A-CN is an ARM® Cortex®-A5 microprocessor IC in the SAMA5D2 series, featuring a single 32-bit core running at 500 MHz in a 196-TFBGA (11×11) package. It is specified for industrial-grade environments with an operating temperature range from −40 °C to 105 °C.

This device targets embedded applications that require integrated interfaces, hardware security, display and multimedia support, and flexible memory options—providing a balance of performance, system integration, and robustness for industrial embedded designs.

Key Features

  • Core  ARM® Cortex®-A5 core, single 32-bit core clocked at 500 MHz for deterministic embedded processing.
  • Multimedia & DSP  Includes multimedia co-processors and NEON™ MPE for accelerated signal and media processing.
  • Memory Interfaces  Integrated controllers for LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI for flexible memory subsystem design.
  • Display & UI  Display interface controllers supporting keyboard, LCD and touchscreen connectivity for human‑machine interface implementations.
  • Connectivity  On‑chip 10/100 Mbps Ethernet (1) and USB 2.0 plus HSIC enable wired networking and host/device connectivity.
  • Security  Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC to protect firmware and data.
  • Power & I/O  3.3 V I/O voltage support for common embedded peripheral interfacing.
  • Package & Mounting  196‑TFBGA (11×11) CSBGA surface‑mount package for compact board designs.
  • Operating Range  Industrial temperature rating from −40 °C to 105 °C for deployment in harsh environments.
  • RoHS Compliance  RoHS compliant.

Typical Applications

  • Industrial Embedded Control  Industrial systems that require an embedded MPU with an industrial temperature range and deterministic single‑core processing.
  • Human‑Machine Interfaces (HMI)  Operator panels and touchscreen displays leveraging LCD/touchscreen controllers and graphics acceleration.
  • Secure Connectivity Devices  Networked embedded devices and gateways using 10/100 Mbps Ethernet, USB connectivity and on‑chip security features.

Unique Advantages

  • Integrated security stack: ARM TrustZone, boot security and cryptography features reduce the need for external security components and simplify secure system design.
  • Flexible memory options: Multiple supported DRAM types and QSPI allow designers to choose memory configurations that match performance and cost targets.
  • HMI-Ready interfaces: Built-in display, keyboard and touchscreen controllers plus graphics acceleration enable responsive user interfaces with fewer external controllers.
  • Industrial robustness: Specified operation from −40 °C to 105 °C and a compact TFBGA package support deployment in demanding embedded environments.
  • Compact surface‑mount package: The 196‑TFBGA (11×11) package helps reduce board area while supporting the I/O required for embedded systems.

Why Choose ATSAMA5D23A-CN?

The ATSAMA5D23A-CN positions itself as a compact, industrial-grade ARM® Cortex®-A5 MPU that combines a 500 MHz single‑core CPU with multimedia acceleration, extensive memory interface support, and a broad set of security features. Its integrated display and connectivity controllers make it well suited to embedded systems that need a balance of control performance, secure operation, and human‑machine interface capability.

This device is ideal for designers of industrial embedded products, HMI platforms, and secure networked endpoints who require long-term reliability, temperature resilience, and a high degree of on‑chip integration to reduce BOM complexity and simplify system design.

Request a quote or submit a product inquiry now to discuss availability, pricing, or to receive technical details for integrating ATSAMA5D23A-CN into your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up