ATSAMA5D23A-CUR

IC MPU SAMA5D2 500MHZ 196TFBGA
Part Description

ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 196-TFBGA (11x11)

Quantity 1,400 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAMA5D2
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package196-TFBGA (11x11)
Display & Interface ControllersKeyboard, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)Package / Case196-TFBGA, CSBGA
RAM ControllersLPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPIREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTCSpeed500MHzSupplier Device Package196-TFBGA (11×11)
USBUSB 2.0 + HSICVoltage – I/O3.3V

Overview of ATSAMA5D23A-CUR – ARM Cortex-A5 MPU, 500 MHz, 196-TFBGA

The ATSAMA5D23A-CUR is a Microchip Technology microprocessor IC from the SAMA5D2 series featuring a single ARM® Cortex®-A5 32-bit core running at 500 MHz. Designed for embedded and industrial applications, it combines processing performance with integrated connectivity, display support, and a broad set of security features.

This device targets embedded systems that require industrial temperature operation, hardware-level security, multimedia acceleration and flexible memory interface options, enabling compact, surface-mount designs in a 196-TFBGA (11×11) package.

Key Features

  • Core Single ARM® Cortex®-A5 32-bit core operating at 500 MHz for embedded processing tasks.
  • Co-processors Multimedia and NEON™ MPE support to accelerate media-oriented workloads.
  • Memory & Storage Integrated controllers supporting LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L and QSPI memory interfaces for flexible system memory choices.
  • Connectivity & I/O Built-in 10/100 Mbps Ethernet (1), USB 2.0 with HSIC, and I2C interface for common embedded networking and peripheral connectivity.
  • Display & User Interface Display interface controllers for keyboard, LCD and touchscreen support, plus graphics acceleration for responsive user interfaces.
  • Security & System Integrity Comprehensive security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC to protect firmware and data.
  • Power & I/O Voltage 3.3 V I/O voltage compatibility to match common embedded system power domains.
  • Package & Mounting 196-TFBGA (11×11) CSBGA package, surface mount, suited for compact board designs.
  • Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

  • Industrial Control & Automation — Use the processor for control logic, network connectivity and secure firmware boot in industrial equipment operating across −40 °C to 85 °C.
  • Human-Machine Interfaces (HMI) — Drive LCD and touchscreen displays with graphics acceleration and keyboard interface support for responsive operator panels.
  • Embedded Networking Devices — Leverage the integrated 10/100 Mbps Ethernet and USB 2.0 + HSIC for gateways, protocol converters and connected instruments.
  • Multimedia-Enabled Embedded Systems — Utilize the multimedia co-processor and NEON MPE for media processing tasks within compact, surface-mount designs.

Unique Advantages

  • Integrated Security Suite: Extensive hardware security features (ARM TZ, boot security, cryptography, secure JTAG, secure memory, secure RTC, secure fusebox) reduce system-level integration effort for protected deployments.
  • Flexible Memory Support: Multiple supported memory controllers (LPDDR1/2/3, DDR2/3/3L, QSPI) enable designers to choose the right memory technology for cost, performance, and power trade-offs.
  • Industrial Temperature Rating: Operation from −40 °C to 85 °C supports deployment in industrial environments requiring wide thermal tolerance.
  • Compact Surface-Mount Package: 196-TFBGA (11×11) package allows high integration in space-constrained boards while maintaining robust mounting.
  • Broad Connectivity: Built-in Ethernet, USB 2.0 + HSIC and I2C interfaces simplify system I/O design and peripheral integration.
  • RoHS Compliant: Environmentally compliant design meets common regulatory requirements for lead-free manufacturing.

Why Choose ATSAMA5D23A-CUR?

The ATSAMA5D23A-CUR delivers a balanced combination of processing performance, security and connectivity for embedded and industrial systems. As part of the SAMA5D2 series from Microchip Technology, it provides a single 500 MHz ARM Cortex-A5 core with multimedia co-processing, flexible memory interfaces and an extensive hardware security feature set suited to industrial applications.

Choose this device for designs that require compact surface-mount packaging, a wide operating temperature range, and integrated peripherals (Ethernet, USB, display controllers) to reduce BOM complexity and accelerate time to market.

Request a quote or submit an inquiry to get pricing and availability for the ATSAMA5D23A-CUR and discuss how it can fit into your next embedded design.

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